Electronics Forum | Fri Dec 18 00:48:35 EST 1998 | Mr Mariscal
I have developing a BGA Process and having problems with 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the stange thing is that it does not happ
Electronics Forum | Thu Dec 17 19:00:14 EST 1998 | Brian Steelglove
Does anyone out there have one we are currently looking at one from a used equipment dealer and would like to know how they work? Good or bad for SMT? Good or bad for high volume Thrue Hole? Thanks Again, Brian Steelglove American Precision Electr
Electronics Forum | Thu Dec 17 19:44:04 EST 1998 | Dave Kalen
| What is the CPH for Universal/Sanyo chip shooter? Spec. needed only. Thanks | Mike, just like the rates that Dave F said, the tact times of the newer Sanyo/UIC machines is .1 or 36000cph. Because of the Direct Drive head, we have little derate so
Electronics Forum | Tue Dec 15 23:20:44 EST 1998 | Dave
| Hello everybody: | somebody know about the formula to calculate the span for a particular component thougth hole, or an specific place where I can find this information. I have been looking at IPC manuals but I didn't find anything. | | any advise
Electronics Forum | Mon Dec 14 12:02:59 EST 1998 | Greg
I have only used two global fiducials except for paneling. The only time I have ever used local fids is when I have a placement problem then I have activated the local fids for that specific part. Your best bet would be to ask Fuji America.
Electronics Forum | Mon Dec 14 15:08:46 EST 1998 | Jim Mitchell
Provided your software supports board stretch and the board is stretched in a linear fashion, you should not need fiducials for each image. If you do elect to use local fiducials, Quad recommends a single fiducial. This method is faster and you can
Electronics Forum | Sun Dec 13 08:49:15 EST 1998 | Ron Costa
Has anyone had any experience with using this alternative plating process? Some board houses are pushing toward this plating. Is there any long term data on this process? Any problems experienced with smt and thru-hole? I've heard tin whiskers to be
Electronics Forum | Mon Dec 14 13:16:11 EST 1998 | MMurphy
| DO you know of an Industry Standard that describes solder paste geometries requirements? | Check out www.alphastencil.com and select "Stencil Design Guidelines". This will at least give you an idea of how to deposit optimum paste volumes based on
Electronics Forum | Wed Dec 16 10:21:44 EST 1998 | HallJ
| Has any body tried reflowing QFP's on both sides of a board. | This has been done for a long time. The only thing I have seen that could start to cause problems is when you get up to the PQFP208 's that are weighing 10g or more. For this You can p
Electronics Forum | Thu Dec 10 13:42:03 EST 1998 | Steve Stevens
I am interested in any information regarding possible failure mechanisms associated with active die (GaAs or Silicon Semiconductors) as a result of being exposed to RMA type fluxes and/or typical SMT industry cleaners. I know that corrosion is one s
