Electronics Forum | Mon Dec 28 15:03:14 EST 1998 | Earl Moon
| We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inor
Electronics Forum | Mon Oct 26 15:59:38 EST 1998 | carlm
| What are the key feature to look for in buying a profiling product for Reflow ? | | Who's is the best and how much do these systems cost ? | | Thanks in advance. | | Hi Mark, I am currently the oven sector engineer for a large CM. I spend a lo
Electronics Forum | Fri Oct 23 04:16:16 EDT 1998 | Tony B
| | My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When
Electronics Forum | Tue Sep 15 19:09:36 EDT 1998 | Scott McKee
| We are a small contract assembly shop hand placing SMT. We recently received a large contract for SMD that will require placement rates of at least 6,000 CPH. I am looking at Fuji, Mydata, Quad, and Zevatech. I have little experience with automated
Electronics Forum | Mon Sep 14 07:19:34 EDT 1998 | Wayne Bracy
DB Sure, it is always possible to "duck in outside air" to use with production equipment, but be careful, you have to determine the air quality required for your process. Cosnsider moisture, contaminates and the actual forcing of air into a confine
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Mon Jul 27 21:10:10 EDT 1998 | D.Lange
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Wed Jul 22 10:21:46 EDT 1998 | Dave F
| Hi all, | I am new to SMT. In past I've made many PCB boards with my small hands at home, but I've used regular technology drilling the holes for the components. | I am trying to use SMT for my projects. SOP packages I was able to solder using a re
Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan
| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW
Electronics Forum | Tue May 26 12:19:53 EDT 1998 | Earl Moon
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
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