Electronics Forum: solder and paste (Page 400 of 752)

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Wed Mar 18 22:53:53 EST 1998 | Scott McKee

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 09:20:39 EDT 1999 | Dave F

| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste

Electrically-Conductive Tapes application advice?

Electronics Forum | Sat Aug 01 04:45:43 EDT 2009 | hohk

Thanks on the advice isd.jwendell! Yes, the piezo ceramic has a Curie Temp of about 800C, so its safe operating temp should be around 300-400C. How about if my PCB is a prototype, would it be more economical to use hand soldering or just manually app

B.I.C. SMT Process Controls

Electronics Forum | Wed Aug 08 21:31:31 EDT 2001 | davef

OK, so yer stuck wid dees sembly guys, yer bosses are moroons wid pointy heads, and you gotta fix it. snafu. Paste printing: Measure shape, height, volume, area, registration, and paste bridging. Inspect/control solder paste deposits for fine pitc

Sn100C Plating, Mixed Alloy Scenario

Electronics Forum | Tue Dec 13 11:27:58 EST 2011 | ck_the_flip

Here's the scenario: PCB Plating: Lead free HASL, Sn100C Solder Paste used: Sn62 (regular tin/lead solder with 2% silver). Anyone see any issues with this? What are the process considerations? Anyone??? PS-9 times out of 10, I don't get answe

A.O.I - no salesman pitch pls

Electronics Forum | Wed Jun 11 09:58:35 EDT 2003 | swagner

Solder fillet inspection is something that I would avoid like SARS, solder joints are like a snowflake no two are the same, henceforth unrepeatability. The only time I would look into this would be for uBGA or flipchip on an audit basis utilizing X-

Low Silver Solder Problems

Electronics Forum | Thu Aug 27 13:14:49 EDT 2009 | ghepo

I have already told you that is not possible solve this problem by e-mail, without perform a detailed failure analysis. Also I have told you to procede by exclusion. Are you sure, by tests, regarding the PCB quality ? Are you sure regarding the solde

Solder Paste Printed Volume

Electronics Forum | Tue Dec 11 13:56:38 EST 2001 | Damian Holzmann

Regarding your comment "technology doesn't seem to have improved". Actually, technology has improved significanty. Cyber Optics uses a line measurement, a new unit from Germany uses sine wave differential measurement. The Gridmeter unit captures a vi

BGA Rework

Electronics Forum | Thu Apr 10 03:29:16 EDT 2003 | emeto

Hi, that post sounds very bad.But I thing you shoul make an order for that problem.First the problem as I can see is not single.If I am right you should do exams step by step: 1.Design of the board-examine very carefuly(ask the manifacturer for help)

No Clean vs. RMA

Electronics Forum | Wed Mar 24 15:08:08 EST 2004 | John

I'm working on a new product soldering to a thick film material. We currently use only No Clean solder pastes. The vendor that supplies the substrate has suggested going to an RMA paste to improve solderability. We haven't used any, but I'm not fa


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