Electronics Forum | Sat Jun 18 08:03:58 EDT 2005 | davef
kenscj: Responding to your points of interest: * On the smoothness of BGA solder balls causing solder ball misalign, void, solder short after reflow: We expect the solder balls to be smooth and have no sharp irregularities. We can't recall attribut
Electronics Forum | Fri Jun 24 04:04:43 EDT 2005 | Rob
Hi, Sorry, should have been more specific. We're looking for one of those benchtop/very small footprint machines to go with a support rail hand printer & benchtop reflow for our design lab to use for low volume prototypes. Something you can plug i
Electronics Forum | Mon Jul 04 22:09:08 EDT 2005 | grantp
Hi, I have one for sale, do you want it! MYDATA machines are perfect for low volume high mix production, and are fairly easy to operate. Don't get a TP model, as they cannot take the HYDRA head, and the MY series are much better. The good thing is
Electronics Forum | Tue Aug 02 23:02:04 EDT 2005 | crishan
Assuming it is not PCB supplier related, here are my thoughts; 1. CHK Component density top / bottom, I am assuming you do bottom reflow first then top. If have alot of heavy comps on bottom it might cause the board to sag in the middle. 2. You hav
Electronics Forum | Thu Aug 11 13:58:57 EDT 2005 | rcanten
Rotations are always confusing. My first suggestion would be to use the program polarity option on your Fuji equipment. This will allow you to keep the same rotational value in the programs if you have to move components between machines. Make sure y
Electronics Forum | Mon Aug 22 10:01:17 EDT 2005 | rlackey
The list is not yet completed but I picked few > different component that our supplier are not > able to get in Lead-Free or problem to get > leadtime: Mfg Part : Zener Diodes BZG03 - MFG : > Phillips Mfg Part : PME271Y447M - MFG: > Evox-Rifa Mf
Electronics Forum | Wed Aug 24 09:52:26 EDT 2005 | javi
Patric, The product is exempted from the RoHS regulativ 1'st phase(2010) and our policy is to follow the new EU regulations as this will also push the Industri technolegy and the SMT process. Our concern is more that we are not able to qualify the p
Electronics Forum | Fri Sep 02 11:44:59 EDT 2005 | Brian
We (ETS) are a manufacturer of reflow, curing and preheat systems and have had similar requests from customers in the past. One in particular required soldering onto an aluminum heat sink weighing approx 5 lbs. You might consider selective/robotic so
Electronics Forum | Wed Aug 31 12:24:50 EDT 2005 | Jaya
I have an new product which I brought from another country which I want to do some buz in my country by knowing the product sctructur and copywtite to make the product locally. It is a song player gadget (like transistor player,handheld sizeable).Th
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
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