Electronics Forum | Wed Feb 26 15:27:21 EST 2003 | robert valles
Sounds like someone before you was dealing with tombstoning components. We have had greater success with triangular paeratures for 0603 and 0402 footprints. Granted the pad will not be wetted completly but IPC requirements are maintained.
Electronics Forum | Fri Mar 07 15:07:50 EST 2003 | davef
YiEng, MA/NY DDave: Usually when the gold plating bath goes south, you loose solderability.
Electronics Forum | Sun Mar 09 19:55:56 EST 2003 | iman
Which specific title books from under your pen, would you recommend for the avid process reader/learner? specific - talking about info/process/data wealth books, and not which books give the most royalties *grinz*
Electronics Forum | Tue Mar 11 12:20:13 EST 2003 | Jim
Look at "Dave's Book Shelf" here: http://www.smtinfocus.com/bookshelf/bookshelf.html
Electronics Forum | Tue Apr 01 11:50:08 EST 2003 | rdr
Dave, thanks for the info. This sounds like it would verify the presence of an open. We have verified that these balls are open and I am trying to figure out if we are fracturing or not wetting. causing these opens. I would use the die method on ne
Electronics Forum | Tue Jul 08 20:47:38 EDT 2003 | davef
Sam: If your gold overcoat was pourous, the nickel undercoat would corrode prior to your attempting to solder and you would not be able to solder without an aggressive flux. Since you see solder flow and wetting, it indicates the gold did an adequat
Electronics Forum | Fri Jul 25 04:55:37 EDT 2003 | iman
does the "non wetting" occur on the component terminals or PCB pad area? It sort of helps to get a better understanding of the symptoms.
Electronics Forum | Tue Sep 30 20:05:34 EDT 2003 | afm
Does alloy 42 lead frame on a QFP100 make lack of coplanarity (let's say 2 mils), a critical factor to have non-wetted leads? Lead coating is tin lead 90/10. afm
Electronics Forum | Mon Nov 17 19:15:24 EST 2003 | Victor
I currently have an inventory of trim caps that have oxidation on the leads. I performed a dip test and am averaging 90% wetting on the leads. On product that has these components already installed is there any risk leaving the parts that have oxid
Electronics Forum | Mon Dec 22 12:41:17 EST 2003 | Marc Simmel
No clean solder paste. One further observation ... the parts have a metal shell and are 'floating' high on the paste. Though there is wetting on the metal shell, it doesn't seem to sink as far as it should and this could be lifting the soldertails f
