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Electronics Forum | Thu Sep 05 11:49:24 EDT 2002 | ppwlee
Hello, I like to hear your comments on applying SPC to solder paste printing. Specifically: - What's the most common and effective method of automated moitoring and control, Paste height/volume or printer parameters? - Actual examples in applying
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Fri Feb 21 19:41:25 EST 2003 | neil
I have had a look at what Bob Willis say's and the answer to my problem is not there. The paste we are using has a very high viscosity and I beleive that if we reduce the metal content to less than 90% it will solve the problem. The problem is parti
Electronics Forum | Tue Mar 11 10:13:15 EST 2003 | genny
Some people have said that for smaller components like 0402, a 2% silver paste (62/36/2)has helped reduce the tombstones. The reasoning is that this paste has a longer plastic zone compared to a true eutectic solder, and if there is any uneven heati
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
Electronics Forum | Mon May 19 02:59:04 EDT 2003 | emeto
Hi, I can give you a few steps. 1. The solder paste. Take the profile that manifacturer gives for the paste. 2. Use termocouple to measure the tempereture. Put PCB and measure the temperature in equal terms. 3. Compare your profile to manifacturers
Electronics Forum | Tue Jun 03 06:29:43 EDT 2003 | mk
Orrrrrr, you could eliminate the printing, shorting, and special surface finishes by bringing the boards in with the paste already on them. There is a process that is a much more forgiving method for applying paste called solid solder deposit. Check
Electronics Forum | Thu Jun 19 10:18:22 EDT 2003 | Dave Milk
Hi Kevin, I hope this info is timely. To qualify a component for lead free use you need to use a lead free paste. The various lead free pastes have very different wetting capabilities and temperatures required to cause them to reflow properly. Yo
Electronics Forum | Wed Jul 09 13:48:03 EDT 2003 | russ
Sam, You may want to be careful with your analisys, reducing paste volume also reduces flux volume. Flux is there to promote and aid in wetting. by reducing flux you may have initiated the poor wetting yourself with the experiment. Just anothe
Electronics Forum | Thu Oct 09 15:57:00 EDT 2003 | davef
Start your recipe development with the recommendations of your paste supplier. The recipe in your new oven should produce identical results to your old oven [assuming you're using the same paste]. Given that your new oven is shorter than your old
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