Electronics Forum | Thu Mar 17 13:03:21 EST 2005 | Slow Ride
When it comes to solder paste, you should worry about volume. Granted height is a part of the equation, but you could have perfect height and still get defects. I wouldn't get too wrapped up in volume either, unless you're evaluating stencil height
Electronics Forum | Mon May 16 06:36:51 EDT 2005 | steve
I see what you mean. Personally I would try a bit of the paste and see what you think prior to production run. If I were you I would get another brand in there. something that offers a "slightly" longer life? I have used "out of date" solder paste ma
Electronics Forum | Mon Jun 13 01:31:36 EDT 2005 | buchi79
Devef, The stand off height is 75micron. We only clean the product after underfill process. Dispense epoxy under the FC & cure it before aqueous wash. Samples are sent for LPC (liquid particle count) Test to ensure cleaniness. By the way, our plant
Electronics Forum | Fri Jul 15 13:16:08 EDT 2005 | Brian
We have seen this problem in the past and had to deal with similar customer constraints. It's not the flux causing the wetting, but the placement and pad geometries as some have mentioned. To reduce or eliminate the problem, we have changed the ape
Electronics Forum | Fri Aug 26 22:12:27 EDT 2005 | iwan
Folks, I have been trying to get information about Malcom SP2 Solder Paste Softener spin speed from Internet and still waiting from supplier. Does anybody know about that one spin speed info? Also how to determine spin time to get a good paste base
Electronics Forum | Mon Oct 24 11:00:11 EDT 2005 | rlackey
You can't really use a pasted board to troubleshoot the program as any components not on target simply slide off with machine vibration and movement as they won't be held by the solder paste. Whereas on double sided sticky tape they remain in place
Electronics Forum | Tue Nov 01 09:21:39 EST 2005 | jdengler
I've never heard of this before. If your solder paste is at the correct temperature, and your process is under control you should have an acceptable print the first time. This sounds like a terrible waste on time and paste. Set up a DOE to prove tha
Electronics Forum | Thu Nov 03 10:49:11 EST 2005 | russ
This is what I would propose, Place and reflow the board without the BGA with your lead process, remove the solder from the BGA pads if you cannot mask off the apertures in your stencil. Then place the BGA and reflow to SAC requirements with a rewo
Electronics Forum | Fri Dec 16 06:46:12 EST 2005 | Rob
How about keeping a fridge near the line and only putting on the stencil what is needed, then topping up from the jar as & when? As soon as the paste hits the stencil flux will evapourate, and all of that time spent by people in labs developing comp
Electronics Forum | Thu Mar 09 16:14:23 EST 2006 | operator
We are fixing to run a board with both pb and pb-free BGA's..double sided.. The board is RoHs compliant so I could go either way on the solder paste. I was thinking pb-free paste would be the best bet. Any opinions would be greatly appreciated. Th
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