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Fine pitch paste release problems.

Electronics Forum | Wed Dec 18 08:19:00 EST 2002 | cyber_wolf

One thing that will also cause this is very slight stencil mis-alignment. Sometimes the paste will have a tendency to hang up in the apertures if you are over hanging just a little on the solder mask. Some solder mask are very slick and will not pull

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 13:20:55 EST 2002 | russ

Your area ratio for this aperture is fine (.78) usually any value greater than .66 will provide a reliable paste release. I would make sure however that the stencil is polished. I agree with other posts regarding your setup and/or paste type is prob

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 16:15:26 EST 2002 | Dreamsniper

Hi Grant Petty, I read about your problem, You might have problem with the design. First on the pad. What is the diameter of the BGA pad in your PCB. We have the same size of PCB and we use 0.584mm Pad dia. and a 10% reduction on our aperture. We us

Baking PWBs prior to wave solder

Electronics Forum | Mon Dec 16 15:00:56 EST 2002 | sueph

We have always baked our assembled boards prior to wave solder, but have recently learned that there are some companies out there who don't. I checked with one of my supervisors, and he said that baking is recommended but not required. I'm wonderin

fine pitch/BGA component handling

Electronics Forum | Wed Dec 18 20:08:36 EST 2002 | jonfox

Are your components not in JEDEC trays? We use Kostat trays and we can bake our parts at or up to 150C. What are your temperature requirements, and what are your parts currently being stored in or on? There are a slew of tray makers out there that

0306 pad design

Electronics Forum | Fri Dec 20 09:01:27 EST 2002 | russ

Greetings, Does anybody out there have any experience with 0306 capacitors (not 0603). I am trying to find a pad design for this component. I have searched the archives to no avail. The component is .06 long by .03 wide with .007" solder terminat

0306 pad design

Electronics Forum | Fri Dec 20 10:13:38 EST 2002 | davef

The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. So, a 1210 chip size has a lower inductance than a 1206 chip. Check with your supplier for recomm

Unconventional way of making a PCB

Electronics Forum | Wed Dec 25 19:36:57 EST 2002 | MA/NY DDave

Hi DaveF already gave you some fine answers. Yes I have seen CNC routed copper PWBs, and the literature is filled with many unique trace types including laying of fine wires on a board or embedded. You wanting .15mm, and I am guessing, low resistan

Unconventional way of making a PCB

Electronics Forum | Thu Dec 26 13:02:15 EST 2002 | MA/NY DDave

Hi Again, As I was thinking about this, I remembered another unconventional way that I was told about from one of the starters of this technology. Now I don't think anyone would use this technique anymore, yet here it is: Press Cutting and Pushing

Component description

Electronics Forum | Mon Dec 23 09:59:25 EST 2002 | jonfox

Typically 1% resistors indicate the decimal position with an "R" 22R1 most likely means 22.1 ohm. Again the best answer is to go to the manufacturer's website to learn how to properly identify the particular component. The ones that really confuse


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