Electronics Forum | Thu Apr 16 10:08:56 EDT 2009 | waveroom
Sorry for the delay. We are actually pretty busy over here. We have found the Aim 257-2 no-clean sac305 paste offers very little if any voiding and better wetting in lead free terminated devices. My suggestion is contact your local Aim distributor fo
Electronics Forum | Fri Apr 17 09:39:07 EDT 2009 | rkevin
I received my sample jar of NC257-2 SAC305 from Aim, and while that may have been true about older Aim paste formulations, this stuff prints and reflows better than anything I have tried and more importantly there were practically no voids on a 256 B
Electronics Forum | Wed Apr 22 14:34:13 EDT 2009 | Quijano
Just to add a comment, we were using AIM Lead Free (SAC 305/ NC254 & 257) in the past and we had Voiding problems, then we tried Indium 8.9 HF, and we have better results, so now we are evaluating change to Indium for many of our products.
Electronics Forum | Thu Jan 21 18:11:24 EST 2010 | colormaker
I have a strange problem with 1208 resistors flipping off placed position. I have the same reflow settings that I have used for years with the same solder paste. PAste is only a few months old and it was used just 1 week ago without problems. Some re
Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
Electronics Forum | Tue Jun 15 19:14:51 EDT 2010 | hegemon
You also need to consider the total metal load in your dispensable paste. You'll need a slightly higher flux content and less metal, say around 87% total metal, in a 4 or 5 mesh size. We had to have some special mixes made in order to do fine pitch
Electronics Forum | Thu Sep 02 12:27:27 EDT 2010 | frankmurch
Voiding is tricky, but some pastes have flux residue that can escape others don’t. It is normally called out. So I would change pastes. If you do not want to do that, try a slightly longer time above eutectic (give the flux a little more time to get
Electronics Forum | Fri Sep 17 16:44:56 EDT 2010 | rdubya
If your pads are long enough you shouldn't have a problem, the pins on the connector are curved up(away from pcb)and will plow solder paste to the end of the pad then it will wick back up the pin during reflow. if you have a second stencil for the bo
Electronics Forum | Tue Nov 02 08:36:51 EDT 2010 | rgduval
Michelle, Our experience with no-clean solder pastes has been that water washing a mis-print is a bad idea. We've found that DI water does not do a sufficient job removing the no-clean paste (the same goes for stencils). Instead, we have washed no
Electronics Forum | Sun Oct 21 22:17:19 EDT 2012 | eadthem
We have had this issue on several parts in the past, typically we use a grid of squares of solder paste on large flow areas, This helps reduce but not eliminate all voiding. I would be very interested in hearing what you come up with. O and what is
Capital Equipment Solutions - SMT | PCBA | TEST
Equipment Dealer / Broker / Auctions
113 S Main Street
Lodi, WI USA
Phone: 6083431779
