Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
Electronics Forum | Thu Nov 01 06:08:42 EST 2001 | John Paul
Hi,Just wondering about the usage of diaster recovery planning for engineering.Due to the current climate we have been asked to develop a plan by a major O.E.M customer. just looking for input from other sites on the layout, proceedure etc. Risk ass
Electronics Forum | Thu Nov 01 17:37:23 EST 2001 | davef
Try: http://www.bcpa.org/ http://www.drj.com/ http://www.fema.gov/library/bizindex.htm http://www.drj.com/new2dr/samples.htm NeoSafety (http://www.neosafety.com) Crisis Manager: Business Interruption Recovery Tool. Designated as a "Best Practices" so
Electronics Forum | Thu Nov 01 15:14:47 EST 2001 | jacob
Hello, I am trying to convince our design engineer to use micro-vias when he has to locate them in the middle of a pad. I heard of the use of micro-vias on this site and was wondering if someone could lead me in the direction of somewhere
Electronics Forum | Sat Nov 03 05:41:07 EST 2001 | Ben
Hi Could somesomeone help to let me know can bare PCB (FR4) is damaged by thermal shock? Can difference of CTE from copper or solder to FR4 damage PCB from apply heat too fast? Any specification or standard can i refer? Thank you Ben
Electronics Forum | Tue Nov 06 12:02:20 EST 2001 | davef
Consider searching the fine SMTnet Archives to get started. For instance: * http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=124&#Message1765& * http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&T
Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Electronics Forum | Wed Nov 07 10:59:55 EST 2001 | paulburt
Hello all, I have been tasked with bringing my company up to spec with J-STD-033, yes lucky me! My question is this: While I was searching the Web for suitable suppliers of dry cabinets I came across a company advertising a humidity control system f
Electronics Forum | Wed Nov 07 17:06:56 EST 2001 | davef
Most of us, here on SMTnet, are either assemblers or sale types. Assemblers use stencils [metal foil, secured in a frame] instead of silk screens. Fabricators use silk screens in various photoimaging processes for applying etch resists, solder mask
Electronics Forum | Wed Nov 07 13:57:41 EST 2001 | Cory
I have been tasked with trying to find out how to do a basic to difficult quote for a job to be manufactured either in a oem or cem. Can or does anyone have any info that could help me get this adventure off the ground?? Is there an easy template or
.gif)
