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Tool to measure SMT component reel quantity

Electronics Forum | Mon Jan 06 11:39:46 EST 2003 | davef

We always hate ourselves when we do this, because it always ends-up laying our guts on the table for someone to stomp on, but we just can�t help ourselves. We do not obtain the same results from both Jon's and Ashok's approaches. Maybe our math in

Tool to measure SMT component reel quantity

Electronics Forum | Mon Jan 06 12:33:14 EST 2003 | gregp

I feel an SMTA vision award coming on. A depth guage sounds like a great idea (especially one designed specifically for that purpose). It should readout "components remaining". But until that product is avaialble, why not just save some of the empt

Tool to measure SMT component reel quantity

Electronics Forum | Mon Jan 06 17:42:36 EST 2003 | gregp

That is true. But maybe for discreets in paper tape where the bulk of your partially used reels is it may be helpful. The rest you can guestimate. Not very good of course. As a placement machine manufacturer I agree every machine should have real

Flip Chip assembly without underfill

Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef

The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200

Stencil Printing Experiment without AOI

Electronics Forum | Wed Jan 08 14:36:44 EST 2003 | davef

It depends on your product requirements. We don't like to print off-pad, because: * Tough to control the amount of paste that squirts onto the board, because the aperture is not gasketed to the pad on the board. * Some paste that squirts between the

Stencil Printing Experiment without AOI

Electronics Forum | Thu Jan 09 12:01:53 EST 2003 | Hussman

It depends on what the finished solder joint looks like after reflow. Use IPC to determine your solder joint acceptablity and check for solder shorts/solder misses to determine how far our of alignment you can go. Hope your not working with theta o

Temp/Humidity Recorders Coverage

Electronics Forum | Wed Jan 08 03:22:18 EST 2003 | MA/NY DDave

Hi DaveF already gave a good answer, which almost falls into the good attorney category. Let me try another good attorney, engineer answer. Depending on your environment place high quality sensors where they are needed, and record the T & H enviro

Concerned with processing 0.75mm c-c Pitch BGA

Electronics Forum | Tue Jan 07 15:14:25 EST 2003 | russ

What exactly are you concerned about? This is from what I can see a pretty standard part (30 mil pitch, 17mil ball). Sorry, I have to convert to inches for my weak brain to work! This part should process very well. Russ

Concerned with processing 0.75mm c-c Pitch BGA

Electronics Forum | Wed Jan 08 10:54:19 EST 2003 | dphilbrick

As Russ says this should process well the BIG BUT..T is what are you using to process this part! How old / capable is your equipment. Screen print quality is a must. Placement accuracy is critical and reflow stability is important. So the answer is d

Essemtec CLM9000

Electronics Forum | Wed Jan 08 03:42:04 EST 2003 | smdtech

Hi All, I'm going to bye ESSEMTEC Pick and Place machine model: clm9000.Can anyone give me som einfo about the machine, the equipment for it,does it work well,does the feeders work well,about accuracy,reliabillity or whatever I should know. If some


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