Electronics Forum | Mon Jun 17 15:25:10 EDT 2002 | lysik
I would look at Universal for sure. They have a ton of late model Chip placer's and GSM's that they will discount heavy. There are so many used GSM's and HSP's on the market you could probably get what you need for a fraction of the cost. You could p
Electronics Forum | Thu Jun 27 02:52:54 EDT 2002 | Darby
Take a peek at a Samsung CP45v before you make a decision. I'm running two before a CP40v. Runs very well. Clever software. Cheap. I'm also running two Tenryu/i-Pulse FV-7100 in line vintage 1999. Great machines but it may be some time before the sup
Electronics Forum | Mon Jun 17 21:20:48 EDT 2002 | davef
Consider slowing down the rate of heating during reflow to eliminate the ejactula. Well, if you feel this is caused by your customer�s design, it is repeatable, you think it�s coming from the reflow process, and you think your reflow process is well
Electronics Forum | Thu Jun 13 15:43:19 EDT 2002 | mjabure
The major draw at NEPCON was the the machine manufacturers. With most of the big players going to the APEX shows, NEPCON attendance has seemed to slow down quite a bit. Although APEX wasn't very busy either. With the industry in it's current state no
Electronics Forum | Fri Jun 14 18:01:04 EDT 2002 | john_wsme
Dave and Russ, Today we modified the profile to ramp up slowly and have longer preheat time. The result is great, 0 out of 5 without bridging. I did review the FAB design and seen the pad is much biger than ball size. So I guess it is the problem.
Electronics Forum | Fri Jun 14 14:19:17 EDT 2002 | davef
Consider: * 007 is a no-clean flux. Some no-cleans you can clean, some you can�t. You may be able to use a saponifier & surficant to clean the residue. Check with your flux supplier for recommendations. * 320�C is higher than the 315�C peak for th
Electronics Forum | Wed Jul 03 22:35:02 EDT 2002 | Stephen
If you can solder in an inert atmosphere you'll find the problem will disappear, even blowing N2 over the surface while soldering will solve the problem. 10�C over peak is not excessive, I've run up to 350�C in some cases, protected by N2 the flux wi
Electronics Forum | Mon Jul 01 21:35:45 EDT 2002 | jersbo
Would rather have lower humidity and strict ESD rules in place.. than a high humidity condition anyday.. High humidity- 45RH + Paste depending on what you use may become an issue.. Components are sensitive... ever get that vacuum sealed bag you dont
Electronics Forum | Mon Jun 17 13:07:11 EDT 2002 | Robert Hartmann
Can anyone point me to a specification or paper describing the existance of voids in transfer mold epoxies during CSP assembly? We have found very small bubbles in our process, but cannot find any information as to whether this is acceptable, and if
Electronics Forum | Mon Jun 17 21:31:23 EDT 2002 | davef
Most of our discussions here on SMTnet have focused on underfills. With transfer molding, voiding near the die, wire bonds, or leads contribute to more failures than others. Try: * Tim Chen, Cookson Semiconductor 800-223-9057 * Ron Molnar, Abpac In
