Electronics Forum: forum (Page 4092 of 7892)

over-shelf-life PCB

Electronics Forum | Wed Jun 19 22:03:23 EDT 2002 | davef

If you can assemble flawless products with these boards, do not be concerned about post-assembly quality issues. There is no current related specification in the US. Although, there may be some old military specifications that apply, but you would

Protection of the component in the double Wave

Electronics Forum | Thu Jun 20 03:29:56 EDT 2002 | Josef

I would like to ask you for help. We use mixed technology and we need to protect SMT components in double Wave. Currently we use the carrier for protection of this component. In this case this procces is not possible to use it due to gap between SMT

Protection of the component in the double Wave

Electronics Forum | Thu Jun 20 08:31:36 EDT 2002 | davef

You can use a peelable, rather than a water washable, temporary solder mask? Points are: * Vinyl peelable is preferred over latex, because of lower residues. You should be very concerned about this since you are probably running a low residue proce

Soldering BGA

Electronics Forum | Tue Jun 25 07:12:46 EDT 2002 | Daan Terstegge

Because BGA's are so hard to rework, you'll want the maximum process window for your reflow equipment, and this includes an inert atmosphere. But as long as solderability and temperature profile are well controlled you can have perfect results with a

Soldering BGA

Electronics Forum | Wed Jun 26 01:08:09 EDT 2002 | ianchan

Hi Dave F, I'd hold you to that "could" opinion of yours... and I'd be most willing to give the new VP ovens a try if such ovens become commerically acceptable to the pocket and match up to our current process control requirements (that we can achie

DoE on post-reflow PCB - warp

Electronics Forum | Tue Jun 25 01:01:15 EDT 2002 | ianchan

Hi mates, has anyone ever done a DoE on the degree of warp PCB, after a SMT Reflow process? what were the findings and conclusion based on such a DoE? which were the critical (DoE) factors that influence the degree of warp PCB? any optimal reflow se

Systems for Solderability-tests

Electronics Forum | Tue Jun 25 09:31:45 EDT 2002 | Myfloh

Hi everybody, Does someone have experience in the assesment of Surface Mount devices? For the moment we have the Must System II of Multicore but it is not effective to assess the solderability of Surface mount devices. Indeed the conditions are not

ESD Safe Fasteners

Electronics Forum | Tue Jun 25 09:29:50 EDT 2002 | CPI

I�m looking for some type of fastener to secure identification tags to boards. The method would be inserting through a tooling hole on the brd .25� npt. We had been using nylon fasteners much like those used in the garment industry. However I am look

ESD Safe Fasteners

Electronics Forum | Wed Jun 26 09:01:47 EDT 2002 | davef

Can�t see where �poly� would be any more �ESD friendly� than nylon. Explain that please. Consider: * Attaching tags with metal wire that has no insulation. * Contacting a factory sales rep that specializes in ESD protection and carries a large numb

Solder Robbing Pads

Electronics Forum | Wed Jul 03 14:34:45 EDT 2002 | razorsek

Jeff, what I generally use as a rule of thumb on multi-row connectors was a strip on the trailing side of the connector as it flows through the wave. The strip was always the same width as the diameter of your through-hole. The distance of the stri


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