Electronics Forum | Sat Jun 23 11:35:58 EDT 2007 | grantp
Hi, Yes, we just built a new plant, and used copper again. The stuff we cut out of the old building was copper, and it was fine without any issues. We lay it on an angle so condensation flows to an end, and can be periodically vented, and we take a
Electronics Forum | Mon Jun 25 10:42:43 EDT 2007 | fredc
On our new shop we used iron pipe in the walls and attic and copper ever where else that can be easily accessed. I saw a pvc material at a trade show years ago that was rated for air lines. With their demo material they could fold it and drive nails
Electronics Forum | Tue Jun 26 10:41:32 EDT 2007 | slthomas
We had a cooler fail once, before we had any SMT. Auto-insert was at the far end of the building, at the end of the compressed air line. When the Unimod (dip inserter) sprayed the operator with water when the pneumatic table rotation motor fired up
Electronics Forum | Tue Jun 26 11:45:52 EDT 2007 | Frank
I certainly wasn't endorsing the use of the PVC piping that was installed prior to my employment there. Also, I recall that all the piping was above the ceiling tiles and regular air line hose was dropped along with the power cables. So there was l
Electronics Forum | Mon Jun 25 11:55:47 EDT 2007 | ck_the_flip
I don't think THEY (Humiseal) know how their material cures. I have a data sheet from them for 1B73, and it says 24 hours at room temperature or 30 min. @ 170�F. We use our in-line oven mainly to dry the material and make it tack-free. You would
Electronics Forum | Wed Jun 27 12:27:46 EDT 2007 | jaimebc
Same error here with our GSM1. Does your GSM have 2 heads? If so, this is how I fixed it. I didn't have a spare Z motor, so I swapped the Z motor for the front head with the rear head. Problem gone. Now since we don't use the rear head as much as we
Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3
I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA
Electronics Forum | Tue Jun 26 21:36:48 EDT 2007 | davef
While your peak temperature measurement is probably correct, you probably ripped the pads from the board long before reaching that temperature. By using a steep temperature ramp, you are causing the corners of the BGA to curl away from the board and
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Fri Jun 29 09:51:27 EDT 2007 | bjrap3
I have never had a problem with any other BGA's that I reworked. I recently found out that the BGA that we are trying to rework is made poorly and warps automatically from the heat. There is nothing that we could do to prevent this. Also the board
