Electronics Forum | Sat Jan 04 09:48:22 EST 2003 | Steve
Yes this is 1st generation, a large metal tube positioned horiz. with valves to wet the wiping towel all at once. We have the newer sys. on the other Ekra, motor driven gear rack and selonoid dispenser.I talked w/ their tech. and got "Oh yea,,they al
Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech
Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu
Electronics Forum | Fri Jan 03 12:05:55 EST 2003 | H Watson
I was wondering if anyone knows of a tool, like a depth gauge, that is designed to measure the component count of partial SMT component reels. Most reels have a built in indicator gauge, but several do not. A tool would be handy for our physical in
Electronics Forum | Mon Jan 06 11:39:46 EST 2003 | davef
We always hate ourselves when we do this, because it always ends-up laying our guts on the table for someone to stomp on, but we just can�t help ourselves. We do not obtain the same results from both Jon's and Ashok's approaches. Maybe our math in
Electronics Forum | Mon Jan 06 12:33:14 EST 2003 | gregp
I feel an SMTA vision award coming on. A depth guage sounds like a great idea (especially one designed specifically for that purpose). It should readout "components remaining". But until that product is avaialble, why not just save some of the empt
Electronics Forum | Mon Jan 06 17:42:36 EST 2003 | gregp
That is true. But maybe for discreets in paper tape where the bulk of your partially used reels is it may be helpful. The rest you can guestimate. Not very good of course. As a placement machine manufacturer I agree every machine should have real
Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef
The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200
Electronics Forum | Wed Jan 08 14:36:44 EST 2003 | davef
It depends on your product requirements. We don't like to print off-pad, because: * Tough to control the amount of paste that squirts onto the board, because the aperture is not gasketed to the pad on the board. * Some paste that squirts between the
Electronics Forum | Thu Jan 09 12:01:53 EST 2003 | Hussman
It depends on what the finished solder joint looks like after reflow. Use IPC to determine your solder joint acceptablity and check for solder shorts/solder misses to determine how far our of alignment you can go. Hope your not working with theta o
Electronics Forum | Wed Jan 08 03:22:18 EST 2003 | MA/NY DDave
Hi DaveF already gave a good answer, which almost falls into the good attorney category. Let me try another good attorney, engineer answer. Depending on your environment place high quality sensors where they are needed, and record the T & H enviro
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