Electronics Forum | Thu Jun 19 23:46:12 EDT 2014 | edriansyah
Hi Evtimov. Yes, correct it is not a race, but I want to know the experience of those who have achieve high speed. Because I ever read some study that mentioned the optimum slope (from room temp to peak temp) is around 1.5°. If I calculate this corre
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Wed Jan 27 09:00:56 EST 1999 | Chris Fontaine
| | I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the
Electronics Forum | Thu Jun 25 20:16:01 EDT 1998 | chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Fri Oct 09 10:57:25 EDT 2009 | clampron
Omid, I have used the DRS24 for many years and have had similar problems with what you are talking about. I do not have any documents but I will tell you what I have seen. It sounds like an inconsistant collpse of the BGA. If one side of the BGA col
Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean
| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60
Electronics Forum | Thu Jul 28 05:41:22 EDT 2005 | K
Hi guys, Have any of you encountered harwin connector M80-647 in the past? Have you noticed any problems with the reliability of the component, solderability and 'reworkability' (thats a new word for sure)? Heres a PDF of the component; http://www.
Electronics Forum | Fri Feb 24 11:32:29 EST 2006 | inds
In addition to the response from Board House... You WILL see delamination at lead-free temp even during reflow.. more often than not.... sometime manufacturer's try to get aways with it by pre-baking the board to remove moisture..but I think one has
Electronics Forum | Fri Nov 30 11:49:20 EST 2007 | nkb2400
If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS met
Electronics Forum | Tue Oct 19 19:25:40 EDT 1999 | Jeff Sanchez
Carol, I think the guys are right about you stand off problem but I want to address the wrinkleing of your masking. Although I think the temps you are subjecting the board to are very high and more than likely creating problems of their own. I th
