Electronics Forum | Fri Aug 06 11:07:49 EDT 2004 | JB
"I thought it was purely a mechanical up-down movement with the cam and hence the thickness hardly has any effect!" It is purely mechanical.On our high speed turret the machine knows the distance between the tip of the nozzle and the top surface of
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Fri Aug 22 14:24:54 EDT 2008 | boardhouse
Paul, I would do two things, eval whole lot for any etching issues as shown above and scrap and two I would have your copper thickness checked, my guess your copper plating will be low. Check plating thickness in Via holes - if less then 8/10th's r
Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
Electronics Forum | Mon Feb 09 16:55:28 EST 2009 | cuperpeter
Hi Sachin, thanks for your feedback. According to our supplier, surface plating is electrolytic gold over Nickel(not ENIG), but I think that is a still improper thickness for Au. (according to 3rd Working Draft from September 2008 of IPC 2221B "0.4
Electronics Forum | Fri Sep 18 09:18:06 EDT 2009 | ysutariya
Also, it wouldn't hurt to perform SERA testing to determine the amount of free tin to begin with. From what I remember, I think you need 30 microinches of free tin to ensure success. XRF won't give you an accurate thickness reading as it counts the
Electronics Forum | Thu Oct 30 23:39:10 EDT 2014 | beilimanu
No paper thing, while I can make some suggestions based on my experience. what is the size of your via? If it's smaller than dia0.4mm, in PCB production process it should be filled by soldermask. So my suggestion is design it to be full filled by SM
Electronics Forum | Thu Oct 17 09:21:24 EDT 2019 | proceng1
We've been getting more and more flex and rigid-flex assemblies. Making carriers for mounting the boards to go through printer and pick & place is becoming more challenging with the size of some of the arrays. Normally we use a pair of pins tha
Electronics Forum | Thu Feb 09 05:38:13 EST 2023 | sandima
Greetings all, I did some measuring and found out that, thick golden line connects metal cases around RS232 pins (plaese check the new picture I added) to only undermost row of 32 rows of DIN41612. Btw, the connection port on the right is DIN41612 w
Electronics Forum | Thu Jun 05 18:11:53 EDT 2008 | jlawson
Also coating costs depends on solids content vs final dry film thickness. Some newer UV coatings are 100% solids, so what you put down you get on the PCB after cure, use no solvents at all. So a cost to look at are qty of PCB per litre of material. T
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