Electronics Forum: yield (Page 42 of 55)

Paste Inspection Requirements

Electronics Forum | Wed Sep 19 15:32:24 EDT 2001 | jschake

I�ll volunteer to answer this one for Jake. In order to prove the performance and capability of the stencil printing process, I think this level of inspection detail is required. However, in a production scenario where a known printing performance

Spacing and Yield

Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake

The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que

Print Parameters

Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake

Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point

0201 solder beading

Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake

I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th

White residues

Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan

Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).

Solder Paste Inspection Criteria

Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis

The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ

Production Line Setup

Electronics Forum | Sat Jun 08 01:31:19 EDT 2002 | fastek

It should be easy enough for you to do your own study to determine if you need more people or not. The first thing that I would do is optimize or balance your line to the optimum efficiency. That is not a difficult task. Once that is done, analyze yo

Yield levels

Electronics Forum | Thu Jul 18 13:11:56 EDT 2002 | gdstanton

Steve, We are touching up 6 - 12% of all solder joints processed. We consider the solder joint to be the focal point of the SMT process. Therefore our metric is based on it. For example in a given month we... 1. Assembled 25pcs of 'A' (IPC-A-610/J

Bottom side SMT wave vs. top side reflow yields

Electronics Forum | Thu Aug 29 20:04:13 EDT 2002 | davef

Steve: I agree. Let�s break it down. * I�d rather print paste than glue any day of the week * But I know yera �Dispenser Boy�. In that case, I�d rather dispense glue than paste. * PTH / primary and SMT / secondary is a tough process either way you

No Clean for BGA's

Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske

Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi


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