Electronics Forum | Fri Apr 23 07:30:35 EDT 2004 | pjc
Adding a Chemistry will reduce density of solution to get under the devices more effectively. You can clean your OA flux residues well enough with just hot water and hot DI water rinse. Top batch cleaners: http://www.speedlinetech.com/electrovert/aqu
Electronics Forum | Fri Apr 30 11:55:55 EDT 2004 | Chris Lampron
Hello Fredrick, I have used several methods of TC attachment including quick set adheasives (not good at reflow temps as Dave suggests) long set two part epoxies (work well if you have the time to wait for a sufficiant cure) temprobes, tape (kapton
Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
Electronics Forum | Mon May 17 02:10:16 EDT 2004 | johnwnz
Straw pole time folks, how many have or are doing wave soldering of Lead free products and are you using N2 in the process, what level of solids are you using and are you cleaning? I've heard a story that soem people in Japan are running a high sol
Electronics Forum | Fri Jun 04 09:30:43 EDT 2004 | gregf912
Grant, The Fuji chipshooters are built with the same mindset as the hydraulic presses and huge motor lathes that were the CP ancestors. The first Fuji CP was a modified motor lathe. They are solid. I can move a Fuji across the country and not have t
Electronics Forum | Mon May 24 16:18:16 EDT 2004 | Sue PH
I have been running this machine for seven years and is the only machine I have ever run. I used to joke with my supervisor that someday they should get a new machine, but only if I could take classes in Tahiti. Well, the old machine just purrs alo
Electronics Forum | Mon May 24 15:45:58 EDT 2004 | mleber
I am interested in how Military / Class 3 manufacturers are handling Gold SMT components. We are receiving an increasing number of tape and reel components that are gold plated. Per J-STD we need to tin all gold components. Are parts being removed fr
Electronics Forum | Tue Jun 01 07:18:15 EDT 2004 | johnwnz
Abraham, it kinda depends on your BGA ball size, device height. The probem is that very few machines will manage to get cleanign fluid under a BGA and you certainly will struggle to get it dry. You would need to look at various supponofiers as well.
Electronics Forum | Thu Jun 24 17:13:44 EDT 2004 | davef
Echoing SheanDalton's comments [above in this thread]: * A good way to strip part markings, solder mask, etc. * A fairly aggressive against most polymers. * A flammable material. * VOC issues in its use. * Assembly workers don't like the smell. * A
Electronics Forum | Fri Jun 25 09:19:12 EDT 2004 | tjensen
60-70% RH will be a challenge if you are running a water wash solder paste (and could be the reason you are seeing the problems). If you are running a no-clean, humidity should not be an issue. As long as the profile looks OK, I don't think the con
