Electronics Forum | Fri May 11 20:55:51 EDT 2018 | jlawson
Rehm Thermal Systems (Germany)offer in process vacuum reflow in convection ovens and vapor phase pending what makes sense - volumes of PCB per hour needed. There are other vendors getting into this of course. Can only get single digit void free join
Electronics Forum | Tue May 29 08:37:52 EDT 2018 | bukas
screen alignment chase clamp state is ON, it can be turned OFF but when I get out of diagnostics machine turns them ON again. Tooling is set to magnetic, and on other machines I have chase clamps are not energized all until board is in machine and st
Electronics Forum | Mon Sep 10 16:55:29 EDT 2018 | wrander1
Hi, I am looking for a Solder jet supplier. Micronic does not support my small dot size LEADED solder paste. I can not use stencil print because my substrate is fragile. I need a run rate of 10,000 dots per hour and 99.99 % dots +- 10% volume. Equip
Electronics Forum | Sat Sep 15 03:31:05 EDT 2018 | colinbenton
My second assembly order on ALLPCB.com is ready to finish soon. I need to provide HS CODE for the custom clearance process this time due to the large amount. Anyone knows the code for this ? At present, I know the ones for 1-2 layer should be 8534009
Electronics Forum | Thu Oct 04 15:11:39 EDT 2018 | emeto
1. From your explanation it looks like you need more flux. Try to overprint a little or use 150um thick stencil 2. You should consider a little different profile - probably try to have a soak zone in the right alloy and flux range and give the part t
Electronics Forum | Thu Dec 27 14:46:32 EST 2018 | emeto
Hi Prem, it will really help if you provide more pictures and metrics. Pad layout, part datasheet, stencil design and most of all picture of the misplaced part on the board. This looks like a very interesting case and I am willing to help you, but t
Electronics Forum | Wed Mar 27 07:01:26 EDT 2019 | charliedci
200uM seems high. I say this because typically our solder stencils in this application are between 80uM and 100uM thick which would leave the component height less than that after reflow. However if your not experiencing any shorting between pads I w
Electronics Forum | Fri Mar 29 00:18:05 EDT 2019 | SMTA-Vikram
3% NDF. We using 8oz 90 degree blade type razor probes, still same issue. Is there stencil we can use or selective pasting test via so flux will not build in testvia. any help or guidance will be appreciate.
Electronics Forum | Mon May 06 06:22:39 EDT 2019 | SMTA-Rogers
Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void?
Electronics Forum | Thu May 09 08:36:18 EDT 2019 | solderkingchris
Hi, You can work on improving stencil design, having the perfect profile and other process improvements but it may be the paste itself letting you down. We have put a lot of work into developing our solder pastes to significantly reduce voiding. Y
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