Electronics Forum | Thu Jul 09 08:04:11 EDT 1998 | smd
OK, I'll take a little abuse as long as you guys are giving me all this great advice. I am concerned about what might happen when a drop here and there comes from the connectors and is absorbed into the box. The box is going to suffer from this. I am
Electronics Forum | Fri Jun 26 19:02:09 EDT 1998 | Rin Or
I am very interesting of getting information about the criteria inspection of BGA. Example, what are percentage allowance for void, solder joint volume etc.. Any information feed back will be greatly appreciated.My factory just install the Nicolet NX
Electronics Forum | Thu Jun 25 17:18:14 EDT 1998 | Vic Graninger
What is the industry standard for calibration compliance certification of SMT machines? and Flow Solder machines? We are currently doing a Quality Audit on one of our manufacturing venders and this questions has been brought up. Any help would be app
Electronics Forum | Thu Jun 25 12:04:58 EDT 1998 | Brian Munzel
looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. thanks for you time
Electronics Forum | Fri Jun 26 11:01:47 EDT 1998 | Justin Medernach
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian, Call me. We'll chat. Tons of stuff. 978 392 3218 East coast time. Regards, Justin
Electronics Forum | Thu Jun 25 06:02:41 EDT 1998 | Chiakl
Hi there, Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? Appreciated for your help. rgs, chiakl
Electronics Forum | Thu Jun 25 08:30:38 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Thu Jun 25 08:30:39 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
