Electronics Forum | Fri May 16 08:13:26 EDT 2003 | radney
We are a mixed volume facility and we are doing our utmost to achieve 55% utilization on HSP's (UIC 4797's and 4791's) We are basing this on a world class metric. I am wondering if anyone else out there is measuring utilization, what sort of result
Electronics Forum | Mon May 19 17:17:41 EDT 2003 | JB
We currently use a Universal GDM for our glue dispensing applications, piston pumps. My question is: Have you had any problems with air getting in the dispense system that will cause missing dots? If so, how have you approached to this problem? Int
Electronics Forum | Tue May 20 13:59:14 EDT 2003 | Mike Konrad
Hi Mike, Here are a couple more good choices: Aqueous Technologies� StencilWash PLUS (unlike �BS�, I will not tout its attributes online and turn this forum into a �BILL�BOARD) Petroferm�s Hydrex WS Contact me offline for specific pro�s and con�s
Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
Electronics Forum | Tue May 27 04:31:59 EDT 2003 | davef
Try: * Operational amplifier: http://www.google.com/search?hl=en&lr=&ie=UTF-8&oe=UTF-8&q=operational+amplifier+20mhz&spell=1 * EPROM: http://www.google.com/search?sourceid=navclient&ie=UTF-8&oe=UTF-8&q=eprom+20mhz
Electronics Forum | Wed May 21 14:47:49 EDT 2003 | radney
On the new 4797 T12W8P feeders we are having trouble picking the very thin chip resistors. Adding foam to the feeder (beneath the pick point) helps, but it only minimizes our frustration. Universal has a reel of these parts and they are looking into
Electronics Forum | Thu May 22 18:47:12 EDT 2003 | russ
I would assume we are talking about a radial leaded electrolytic cap? We use Electronic grade RTV (Dow corning 3145). It sticks good and can be removed if necessary. It is also pliable so you don't have to worry about CTE or other stresses that may
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Tue May 27 11:59:14 EDT 2003 | blnorman
Is anyone aware of any reports, studies, articles on the subject of silicon contamination in SnPb solder joints. We are evaluating repair of conformally coated (silicone) boards. The fear is that we will never totally remove the silicone and once i
Electronics Forum | Wed May 28 05:31:17 EDT 2003 | dougie
Hi, Can someone please give me an IPC standard number or similar for decal design when wave soldering SMT components on the underside of a board. Hopefully a document exists detailing design rules, the components ideal attitude to the wave, suitabil
