Electronics Forum: stencil (Page 412 of 540)

Cpk Variables Control for Paste Printing

Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan

Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh

I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean

Solder paste for RF boards

Electronics Forum | Mon Apr 15 21:27:16 EDT 2002 | djarvis

Everything we do is RF and have had no problems in the last 7 years with - Indium NC-SMQ92J, Sn63 Pb 37, 90.25% Metal, -325+500 mesh. Stencils are always 0.005" thick. However I will qualify that by adding we are an OEM and each new product may requi

BGA Assembly

Electronics Forum | Tue May 28 17:33:31 EDT 2002 | wilcoxito

We are just getting started doing BGA assembly at our plant. Any helpful hints would be greatly appreciated. My first main question is about stencils. We are considering using diamond shaped holes for the BGA pads. Does anyone have any experience

BGA Assembly

Electronics Forum | Wed May 29 00:28:11 EDT 2002 | alex_kirichenko

Hi Ben! I was in your position just over 12 months ago.. We use round appetures for BGAs and don't have any problems with it, as long as thiknes of your stencil is correct. As for baking BGAs befor placing. I haven't had any problems with devices

BGA Assembly

Electronics Forum | Wed May 29 14:42:53 EDT 2002 | jaltland

I have another question about bga's and stencils. We were told by a manufacturer to use .012 square apertures for .009 dia balls. The original pick & place and reflow goes pretty well (over 95% good), however when we have to select components on th

REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS

Electronics Forum | Wed Jun 26 15:34:09 EDT 2002 | Daan Terstegge

It does work, but you must keep in mind that not only the stencil must be designed for it, but also the board. Trying to use the pin-in-paste process for a connector with an ordinary wave-solder layout will result in lots of touch-up. You'll need sma

Reliability of U-shape appetures

Electronics Forum | Tue Jul 02 21:47:44 EDT 2002 | alex_kirichenko

Hello everybody!!! We are going to start loading 0402s and I'm looking into all diffirent sorts of problems. From this forum I see that tombstoning is the main one. I found article about using U-shape appeture design for 0402s. I never had stenc

Reliability of U-shape appetures

Electronics Forum | Wed Jul 03 20:21:26 EDT 2002 | alex_kirichenko

Thanks for responding..... The question I was trying to ask is if U appetures are mechanicaly strong, if the tab in the middle won't stik up and damage squeegee blades? I never had stencil with such appeturs. We are just about to start some trials

BGA's and the Fuji IP2

Electronics Forum | Mon Jul 15 09:41:11 EDT 2002 | soupatech

I am experimenting with 2 types, FG256 17x17mm and FG456 23x23mm both with a 1mm pitch and .5mm ball. They both have a full array. As for as the x-ray, we are looking into pruchasing some used equipment but will mostly send them out for testing until


stencil searches for Companies, Equipment, Machines, Suppliers & Information