Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Fri Dec 22 09:39:22 EST 2000 | CAL
Some random Ideas when I read you post...... 1) If it works don't fix it. 2) Be aware of the temp threshold of your components....Over heating components is not good. Over heating is not good period. 3) The Solder paste Chemistry you are using maybe
Electronics Forum | Wed Dec 13 12:08:57 EST 2000 | Stefan Witte
Apparently the adhesive tape peels off from the joint, which could have some reasons. 1. There should be an overlap of the cover tape, as Cal mentioned. The new cover tape laying over the old by approx. 2mm. I also peel the cover tape a bit off, whi
Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M
Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa
Electronics Forum | Wed Nov 29 21:05:33 EST 2000 | Michael Parker
Chris- you did not mention some details regarding your processes and volumes. Are you using SMT, PTH, mixed? Machinery involved (automatic vs. manual). Volumes - same 4-20 assemblies, at what periodic rate? Are you doing R&D prototypes only? High or
Electronics Forum | Thu Nov 30 04:02:26 EST 2000 | Chris May
Michael, Thanks for your response. More info:- The processes are as follows, Stencil Print (6 thou on DEK 248) Placement on Contact 3AV and Reflow on BTU 4 zone Top & Bottom oven.It is not an In-Line system. Our board technology is mixed but heavi
Electronics Forum | Wed Nov 22 15:09:52 EST 2000 | Finepitch Services
Chryzs, I've used AIRVAC and SRT (with their old adjustable 4 piece nozzle system). I also saw the APE Chipmaster... Here's my 2C after all that: Whoever claims he/she has a user friendly system is a big liar. The words are correct but the order is
Electronics Forum | Sun Nov 19 16:01:18 EST 2000 | Dean
Hi Friend. I recently went through this same project in my factory. Initially, I spent quite a bit of time out on the lines (6) collecting data. After getting an overall idea of where and what the activities were I created forms and work instructio
Electronics Forum | Tue Nov 14 13:39:37 EST 2000 | Mark S
Hi All -- I'm about to design a DPAK part (case 369A-13, Issue Z)onto a PCB . The part's maximum length as given in the datasheets (On-Semi MAC4DHM) is 0.030" longer than the recommended land pattern as given in that same datasheet. (1) Has anybod
Electronics Forum | Thu Nov 09 10:22:46 EST 2000 | John
Luckily for me, if the part were soldered and on the board prior to any processing, I will still be able to build it. I am currently experimenting with screen printing a high temp paste, hand inserting the part (even Chad hasn't come up with an econ
