Electronics Forum | Tue Jun 01 19:19:24 EDT 2004 | Ken
single is for a single model. In other words, your "fiducials" are identical or near-so. Multi means your using multiple models. The machine will use individual models for alignment. I would use multi on pads. Is this an SPM machine? I bet your
Electronics Forum | Thu Jul 15 07:08:29 EDT 2004 | pcbrown
Basically, it's a tilting problem of certain devices. Usually with axial by-pass caps tilting, which pulls the lead up through it's mounting hole. Other problems with components with leads cut to lenght to eliminate post-wave trimming. All suggestion
Electronics Forum | Mon Jul 19 08:55:54 EDT 2004 | dwanzek
Thanks, good input. The joints do seem to wet well, they pass solderability test we have done. The defect is apparent right after reflow, before wave solder. No we do not profiled with the oven loaded..... good idea. We run an ovenrider each shift an
Electronics Forum | Tue Aug 17 11:44:19 EDT 2004 | rlackey
Hi, does anyone have any real experience in using the following AOI systems (including opinions on support)? Cyberoptics Flex Agilent SJ50 MVP Supra Landrex Optima (Teradyne) Please fight the urge to pass comment or point out the error of my ways i
Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Sep 21 13:00:04 EDT 2004 | Bob R.
We found a simple solution to this dilema. We told the QC department that we (manufacturing engineering) would be happy to give them control and that we would make no changes to an x-ray algorithm or pass/fail limits without them being on site and g
Electronics Forum | Mon Sep 20 19:46:16 EDT 2004 | pabloquintana
We use Envibar UV 1244 to coat our PCBs after wave soldering. We clean them with alcohol, and then we coate them manually with a brush. Then they are passed through a UV Oven. We have adhesion problems, and we started by looking at the Envibar, but
Electronics Forum | Fri Sep 24 20:02:39 EDT 2004 | pabloquintana
OK, We have tested and changed several things in our process, but we still getting the same result. We are trying another type of coating. We will see later. My question now is what is adhesion wise acceptable in the industry. I know many of you wi
