Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter
Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan
Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle
Electronics Forum | Fri Aug 19 21:12:58 EDT 2005 | grantp
Hi, We are not based in the US at all, but the US PCB manufacturers are the only ones that combine good customer service, the ability to product rapid prototypes without huge setup costs, and meet deadlines. As the global electronics market has chan
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Mon Dec 01 12:39:06 EST 2008 | tsvetan
this is really nice one ;) paper and cotton have lowest potential to generate static electricity see below, and usually is good practice to wear cotton glowe at least to one of your hands to not leave greasy finger spots on the gold finish of the PC
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
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