Electronics Forum | Wed Apr 19 08:19:41 EDT 2006 | davef
So, your solder ball didn't collapse. What is the ball material? More and more BGA are shipped leadfree. For image posting, look here: http://www.free-webhosts.com/free-image-hosting.php
Electronics Forum | Wed Apr 26 09:15:23 EDT 2006 | Carol Stirling
That would be correct. Some others call it `Head in Pillow'. The BGA balls are 63/37 and the board it's mounting to is HASL.
Electronics Forum | Wed Apr 26 10:33:57 EDT 2006 | Carol Stirling
Hi Russ, The board was ran in two orientations but with poor results. The same area of the BGA failed. I was advised today that the Process Engineer here has come to the conclusion the defect is Pick and Place machine oriented, not a process/pro
Electronics Forum | Thu Apr 20 17:51:52 EDT 2006 | Geo
When we have warpage issues we use Titanium Panel Stiffeners even though the stiffeners are mainly used for Wave we find little issue for reflow. Mind you the boards have to be large enough.
Electronics Forum | Mon Apr 24 09:41:34 EDT 2006 | pjshiloh
Hello TA, Novastar's Model 18X2HT sounds like it will meet most of your requirements. If you would like detailed information about it, please contact me at pjshiloh@novastarinc.com. or (215)947-4700. Regards, John Shiloh
Electronics Forum | Tue Apr 25 14:32:18 EDT 2006 | slthomas
Hoss, that's what we do here. Slotted Durastone bars is all it takes unless the board is big enough to require a center support
Electronics Forum | Tue Apr 25 22:32:51 EDT 2006 | davef
We've talked about this previously on SMTnet. Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17463
Electronics Forum | Wed Apr 26 09:39:44 EDT 2006 | russ
Sorry, If you need to do this, I would run a high temp alloy in the first side and then a lower temp on the second side. Components must be able to withstand the high temp process for the first side. Russ
Electronics Forum | Wed Apr 26 07:56:22 EDT 2006 | davef
Since the connection improves when you touch it with a soldering iron, it indicates that the reflow recipe is NOT good. Something may have changed with the termination material requiring a higher peak temperature.
Electronics Forum | Tue May 02 07:56:58 EDT 2006 | billyd
Yeah, that's what I'm doing now. I have it now peaking around 235, with about 70 sec. above 220C. (220C is the reflow temp, according to manufacturer. I've always used 217C for Pb free) Wish me luck. Thanks!
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