Electronics Forum | Wed Jul 19 17:58:45 EDT 2000 | Darby
Moving Heavy Machinery, We will be reconfiguring four smd lines after some building alterations are completed. What are the latest tricks/tools peolple are using for lining up their production lines. Lumps of 4" x 2" and trolley jacks work fine for t
Electronics Forum | Wed Jul 19 17:34:25 EDT 2000 | Deon Nungaray
Craig, I'd be really hesitant in pursuing this method for a TQFP. Remember, most SMD's are rated for a maximum rising slope of around 4C/Sec. Immersing a fragile TQFP in a hot wave of molten solder will probably exceed this ramp up rate. Besides thi
Electronics Forum | Mon Jul 17 20:20:53 EDT 2000 | Dave F
There is a wide range of price points and configurations for such equipment. RFA (Read the Fine Archives) and contact the suppliers (supplier lists are in SMTnet and "SMT" & "Circuits Assembly" etc magazines) and get back to us with specific question
Electronics Forum | Fri Jul 14 11:34:37 EDT 2000 | Mike F
John, The first thing to check is how tight the boards are being held in the conveyor (assuming you are using a finger conveyor). They should be a little loose at the input end so there is some room to expand. If the boards are held too tightly, when
Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Fri Jun 16 17:30:04 EDT 2000 | Eutectic state
Go with Universal. We had Fuji equipment for years. That is all but phased out now and we only are buying Universal. You cannot beat their service. The chip shooters are great. The only cons that I have dealt with is the learning curve on the n
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Thu May 18 23:22:44 EDT 2000 | Micah Newcomb
Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, I
Electronics Forum | Fri May 05 07:05:00 EDT 2000 | TNT
Greg, You describe the Panel as being made up of 4 PCB's each rotated 90 degrees to its previous circuit. If this is true, the placement rotation changes enough that it would probably be best to define the entire panel as a single PWB. If you wante
Electronics Forum | Wed May 03 20:10:57 EDT 2000 | Dave F
Erhard: Several companies make feeders that move leadless chip components from a bulk feeder carrier, line them up head-to-tail, and present them to the pickup head of a high speed placement machine. Try: * Panasert * Suzuki � but you probably a
