Electronics Forum | Thu Jun 26 09:50:05 EDT 2003 | James
To Brian W. I think I will use your concept thanks for the help and from all the others that gave me suggestions. I seem to get best results from a Low temp at first with hardly no soak and just a ramp to spike. Thanks again.
Electronics Forum | Wed Jun 18 09:43:42 EDT 2003 | blnorman
We have a line that is double sided reflow and reflow/wave depending on the product being manufactured. We asked Loctite if we could cure our chipbonders with the reflow profile to eliminate having to change oven profiles for each. They said we wou
Electronics Forum | Tue Jun 17 10:14:36 EDT 2003 | sergiovito
Hello Everyone, I am assemblying a special Panel PCB, dimensions 330 x 250 mm with 8 single PCBs in it. After SMD reflow oven, the panel is bending and this is impacting in the next process - solder machine. some areas on the PCB aren't touched by t
Electronics Forum | Tue Jun 17 11:18:20 EDT 2003 | Claude_Couture
How are the 8 units distributed on the panel? 1 X 8, 2 X 4? Are there "V" groves scored in the panels to "break away" the units? Do you run on edge conveyor in the reflow oven? You need center support if you have 2X4 pattern with "V" grooves. Or us
Electronics Forum | Tue Jun 17 15:51:42 EDT 2003 | equipres
Jipp, we sell used equipment for PCBA. I could most likely steer you in the right direction if I knew a little bit more about your product. Feel free to e-mail sales@equipmentresource.com or give me a call at 303-287-9333. Ken Fry Equipment Resource
Electronics Forum | Wed Jun 18 16:06:32 EDT 2003 | russ
Not that it is important, but Manncorp is not an O.E.M. They buy equipment and put there name on it. Sometimes this can lead to service issues (sometimes they need to call the OEM to resolve issues which can lead to delays). I am not saying that th
Electronics Forum | Thu Jun 19 20:03:33 EDT 2003 | davef
Most of the BIG board fabs give comparisons, like you seek, on their sites. For instance: http://www.merix.com/main_res.html We have no relationship nor receive benefit from the company referenced in the above link. Finally, consider immersion ti
Electronics Forum | Thu Jun 19 12:47:47 EDT 2003 | russ
I would believe that the connector spec is for the max temp that it can withstand while the paste is the max temp that you need to achieve. Solder balls are usually from excessive ramp rates in the oven. I would contact the connector mfg. and see wh
Electronics Forum | Thu Jun 19 20:09:19 EDT 2003 | John Tobias
I'm new to this forum. I hope that this isn't an old topic. Sales people in my company have told me that there is resistance to the use of QFN (LPCC) packages by small Asian (primarily Korean Repeaters and Chinese CATV) manufacturing houses. Does
Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob
Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion
