Electronics Forum: boarded (Page 416 of 1638)

OT: Wavesolder Process Engineer Needed

Electronics Forum | Mon Jul 14 15:25:52 EDT 2008 | patrickbruneel

CK, If the contact length with the wave is decreasing when decreasing the conveyer speed and visa versa you need to check the machines electrical or electronics something is very wrong. Contact length is determent by wave design, wave height, convey

ive solder profiles

Electronics Forum | Tue Jul 29 12:51:40 EDT 2008 | grics

I am having some problems with some of my pcbs at ive solder. We are using an ersa versaflow. It has an automated spot/spray fluxer (Interflux Pacific 2009M) , 1 preheat stage, a leaded pot/nozzel, and finally a lead-free pot/nozzel. Nozzels move, b

Taintalum Caps

Electronics Forum | Wed Aug 20 08:23:36 EDT 2008 | davef

Your tantalum capacitor supplier offers the best advice. We're not sure of the package that you plan to use. * If you are referring to molded package, surface mount, tantalum caps, yes, they can be wave soldered. Smaller case size chips (eg, Kemet A

Solder not reflowing properly

Electronics Forum | Wed Aug 27 14:38:20 EDT 2008 | rgduval

Does your paste provider recommend a TAL? For the leaded and lead-free pastes that we use, the manufacturer recommends 60 seconds above liquidous. I note that your profile shows the TAL as 30 seconds, which may not be sufficient. That said, tho

problem in solderability

Electronics Forum | Thu Aug 28 16:18:55 EDT 2008 | realchunks

So just send a board to your company and that's root cause analysis? LOL... Ok sure. I guess I'm too much of an engineer and like to get to root cause by eliminating all the question marks and double checking my findings. Part of THAT kind enginee

problem in solderability

Electronics Forum | Wed Sep 10 14:39:30 EDT 2008 | vladig

No, we didn't do the test you mentioned, but did EDS on the joints and didn't see carbon their (which would indicate the presence of any organic-based contaminant). For the customer the issue was closed and passed to the board shop. We did work with

Clean vs No-Clean

Electronics Forum | Wed Sep 10 08:16:23 EDT 2008 | ck_the_flip

I guess sarcasm and quick wit flies over some peoples' heads. 8 years ago (wow, that's an old post), I was poking fun at the guy, and wanted to illustrate how ridiculous it was that he spat upon our printed circuit board assemblies to simulate moist

PCB immersion silver discolouration

Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef

We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef

For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components

BGA soldering & BGA ball formation

Electronics Forum | Mon Nov 17 09:47:25 EST 2008 | cisridn

I would not recommend doing BGA soldering with only a hot air gun. I have done it in the past, but the boards would eventually come back from the field because the solder joints did not form correctly and the BGA would have to be reworked again. I


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