Electronics Forum | Tue Nov 02 23:34:58 EST 1999 | chartrain
You appear to have two problems working against you at once. One is component lead corrosion that the no clean flux isn't aggressive enough to remove. Do a simple dip and look test. Flux the leads of a component and dip it into the molten solder for
Electronics Forum | Thu Oct 14 10:49:13 EDT 1999 | Dan Woodward
Andrew, As I read about issues with reworking connectors, whether they are surface mount or PTH soldered, I wonder if compliant pin pressfit connectors are being considered. They are easily assembled after all SMT without any thermal input, and on e
Electronics Forum | Fri Apr 10 15:59:51 EDT 1998 | Justin Medernach
| We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The
Electronics Forum | Sun Apr 05 18:36:41 EDT 1998 | Graham Naisbitt
Sylvia, I believe you will find that contrary to Scott Cooks submission, that the work carried out by Robert Clark of Hughes Missile Systems at (then) Tuscon Arizona formed the basis of the MIL-F-14256 spec which "Qualified?" or at least "Approved" O
Electronics Forum | Tue Nov 13 19:58:28 EST 2001 | davef
No. I have never measured the temperature of the top of a BGA package during wave soldering. Mr. Kelly�s "actual body temperature" of 140-150�C during wave soldering is probably accurate [most of the time]. It�s the utility of this measurement tha
Electronics Forum | Tue Nov 05 18:17:00 EST 2002 | russ
This sounds like a contamination issue with the HASL finish.(solder on lead but not on pad). I have experienced this before and it was related to the HASL process at our supplier. They found some type of contaminate in the bath (unfortunately I can
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Tue Jan 15 12:37:17 EST 2008 | gregoryyork
SORRY I did not offer a solution so here goes - The best way to get rid of this issue if you cant change flux is to reduce your flux consumption to a minimal with a spray flux and keep the heat REALLY high to boil off the alcohol before it can be abs
Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef
You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough
Electronics Forum | Tue Apr 10 09:28:54 EDT 2012 | davef
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