Electronics Forum | Fri Feb 14 22:02:04 EST 2003 | caldon
DAVE- The way we got around it was simple- Our Mole for profiling is RF and the cell phones would interupt the data transfer so we nixed all cell use. Also, our BTU oven was in constant RF communication with our KIC and so cells were band from the fl
Electronics Forum | Mon Feb 17 02:51:21 EST 2003 | Scott B
We have also had this problem. I have managed to get around this by selecting a teach video model and positioning the teach window to include half the pad on the left and half the pad on the right so that the center point is bang in the middle of the
Electronics Forum | Wed Feb 19 20:52:49 EST 2003 | davef
Consider that: * Something may be wrong with your glue. [That you have globs of flat glue on your board seems to indicate that your glue is probably cured properly. How easy is it to "pop" components from the board?] * Someone has put a goopy crud o
Electronics Forum | Fri Feb 21 19:54:16 EST 2003 | jersbo
Make sure your epoxy dispenser is repeatable. DO an experiment , inspect every board to verify epoxy is there before the part is placed... Is there an epoxy residue left on the PCB where the parts fall off after wave??? We do the epoxy paste proce
Electronics Forum | Tue Feb 25 15:29:46 EST 2003 | MA/NY DDave
Hi Locktite is telling you to cure first, maybe for a good reason. So the epoxy becomes stable just before solder reflow moves stuff around and around and then settles. A WEG yet if you did some cross sections and analysis you might find piles of
Electronics Forum | Tue Feb 25 23:17:12 EST 2003 | MA/NY DDave
Hi Up above in his operation / process description after a call to Locktite and then my note and then your note, we may have found the problem. One never knows at a distance. It appears he is striving to do soldering/reflow first and then concurren
Electronics Forum | Wed Feb 19 21:20:17 EST 2003 | davef
Consider: * http://www.ecd.com/Seminars/bobwillis.asp * http://www.assemblyonline.com/ Intro%20to%20Surface%20Mount%20Technology%20T&CF.doc * http://www.smta.org/ * http://www.rayprasad.com/training.html * http://www.omnitraining.com * http://ww
Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Electronics Forum | Fri Feb 21 02:00:53 EST 2003 | successmani
Hi, I would like to know how Conductive adhesives and UV cure adhesives are dispensed. I know that nonconductive adhesives are dispensed through jetter, Auguer pump annd other contact type method. I am puzzled and curious to know whether there is any
Electronics Forum | Fri Feb 21 08:41:06 EST 2003 | davef
Yes. Reflow soldering PTH components goes under different names. * SMTnet's friend Bob Willis popularized the "intrusive reflow soldering" term. * Jim Blankenhorn, another of our friends, and others popularized "pin and paste". * Still others use
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