Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Tue Aug 17 22:51:32 EDT 1999 | KEVIN SIMPSON
| | Does any one have any idea which is usualy more expensive, to get components on Reels or in Trays ( I mean large components ofcourse). | | What is price diffrence percentage ? | | | | practicaly, is one method is prefered to the other? | | | |
Electronics Forum | Thu Aug 12 17:03:44 EDT 1999 | Brian Wycoff
| | Q.C. manager asking me about spc's for Mydata Pick & Place. | | Other then Visual inspection, is there other ways to automate | | placement inspction? | | | | Thanks | | | Sure! There are a few automated vision systems available today that co
Electronics Forum | Thu Aug 05 10:55:09 EDT 1999 | Wolfgang Busko
| | | | | | Hello, | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but
Electronics Forum | Tue Jul 20 06:36:50 EDT 1999 | Peter Brant
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | Hi, The usual method is ATE, also known as a "Bed of nails" Basicall
Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa
| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d
Electronics Forum | Wed Jul 14 17:03:15 EDT 1999 | John O'Brien
I'm doing some basic research in trying to understand the purpose and drivers that cause bar code (or other) marking of PCBs. I would appreciate any knowledgable volunteers willing to speak with me -your name, number, the best time for the call- or r
Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko
I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t
Electronics Forum | Sat Jul 17 17:42:02 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
Electronics Forum | Sat Jul 17 17:42:03 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
