Electronics Forum | Thu Dec 11 19:24:55 EST 2008 | gregoryyork
some lead free solders do not flow well and need encouragment. what are you using solder/flux wise and machine/settings including dwell times cheers greg
Electronics Forum | Wed Jan 07 05:53:05 EST 2009 | sm2009
Hello, does anyone know if it's possible to wave solder 0402 components? Are there drawbacks? Where can I find technical details about recommended footprint and glue point? Last question: are there suggestions about wave soldering for ic with 0,635mm
Electronics Forum | Tue Jan 20 17:12:25 EST 2009 | smt_guy
Thanks guys. They are seen on some of the pads too. What will happen if I continue to solder them and I got a good solder joint formation? Will the pad continue to erode or corode in due time? or the solder that will recoat its surface will prevent
Electronics Forum | Fri Jan 23 09:21:22 EST 2009 | sm2009
Hello, thanks to everyone that reply to my previous question. I have another request: is it possible to solder polyester capacitors (case 2220) with wave soldering process? Thanks! Regards, Stefano
Electronics Forum | Wed Mar 04 06:14:05 EST 2009 | sachu_70
The trick would be to externally pre-heat your Metal cavity to attain sufficient temperature and then to flow in solder. This would ensure proper solder distribution inside the cavity.
Electronics Forum | Tue Mar 17 08:20:59 EDT 2009 | scottp
I work for one of the largest automotive suppliers. Our Workmanship Standards pre-date IPC-610 but they are nearly identical in regards to solder balls. We supply to all the major OEMs, including the Japanese, and I don't recall our solder ball sta
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Sun Jul 26 17:13:31 EDT 2009 | slthomas
Is it possible that the assembler is using solder wire that's too small for the application and feeding it too quickly to compensate?
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
Electronics Forum | Mon Aug 24 11:41:41 EDT 2009 | tds
I rebuild solder recovery systems that are used during the dedrossing of solder machnes. My number is 330-724-3333. We have sold a lot of these machines and have plenty of references. Scott Wilson
