Electronics Forum | Wed Jan 14 23:08:19 EST 1998 | Ron Costa
Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will re
Electronics Forum | Wed Oct 10 21:31:17 EDT 2001 | cnoonan
I used to rework many types of BGA's including ceramic. We always preheated the whole board to around 115 c before attempting to remove or place. Now I find myself in a new company with different ideas. Do any of you have a site that has exact rec
Electronics Forum | Sun Jan 11 11:59:13 EST 1998 | Bob Willis
VP does work well for BGA Technology but it is not any great improvement on convection reflow. It has been stated in a coulpe of articles that there is no delta T difference with VP from the surface ofthe board and under the BGA. That is not true jus
Electronics Forum | Thu Aug 16 10:49:35 EDT 2001 | JohnW
Dave, we try and keep the temperture that a BGA is exposed to at wave solder below 150 deg C. At this temperature it's unlikely that you'll get near to starting secondary reflow of the device or that you'll grow any significant amount of intermetall
Electronics Forum | Tue Sep 11 09:13:01 EDT 2001 | davef
Like most things in electronic assembly, this is not astrophysics. People have pasted boards, placed components, turned the board up-side down, run the board through a reflow oven, and generalized about which components: * Fall off the board. * Don
Electronics Forum | Mon Sep 17 14:57:11 EDT 2001 | ert002
We are printing 0.012" apertures on a .012" Solder mask defined pad in a fine pitch BGA application. The board is 0.032" thick with very little room on the bottom to place support pins under these areas. Our first pilot proved extremely difficult to
Electronics Forum | Tue Sep 25 12:49:58 EDT 2001 | Hussman
Been there - done that. Makes a mess on that 2nd reflow process- doesn't it!?!?!? This is caused by design. If the open via is located in the land area, it will flow thru the via and cause pumps on the opposite side. You can have your vias filled
Electronics Forum | Wed Oct 10 21:35:39 EDT 2001 | cnoonan
I used to rework many types of BGA's including ceramic. We always preheated the whole board to around 115 c before attempting to remove or place. Now I find myself in a new company with different ideas. Do any of you have a site that has exact recomm
Electronics Forum | Mon Oct 22 13:21:12 EDT 2001 | Michael Konrad
Eric, The Kolb RB6D (and the RB5D) are not ultrasonic cleaners. They are high pressure spray cleaners. I would not recommend high pressure spray cleaners for misprinted assemblies with previously placed components (unless you don�t mind solder pas
Electronics Forum | Wed Oct 31 11:10:28 EST 2001 | Claude_Couture
In theory, no tweaking is necessary. Unless you happen to work with equipment old enough to vote! We have several lines with old MK chip shooters. of course, we use the same program for all the lines. There is no way to calibrate each machine so that
