Electronics Forum | Wed Jun 02 12:14:09 EDT 2010 | smt_guy
what is the scenario? The more the solder joint the more capacitors are prone to mechanical stress or the lesser the more mechanical stress? what about uneven solder joint fillet? one side is 25% then other side is 75% or 100%? please put in your
Electronics Forum | Wed Jun 30 16:08:42 EDT 2010 | davef
You'd don't solder to gold finishes. The gold finish goes in solution in the solder and the solder attaches to the underlying surface, commonly nickel or copper.
Electronics Forum | Fri Jul 23 02:17:26 EDT 2010 | joseph_smile
by viewing your posting i came to know this is solder ability issue which is because of marginable solder ability of PCB / components, just ensure that issue due to PCB or component . check the msl of of substrate / component. verify the baking r
Electronics Forum | Mon Aug 09 12:36:19 EDT 2010 | cobar
IPC TM 650- Solderability of Metallic Surfaces http://www.shanelo.co.za/List%20of%20articles/IPC%202.4.14%20Solderability%20of%20Metalic%20Surfaces.pdf
Electronics Forum | Wed Aug 18 11:12:04 EDT 2010 | davef
So with your mounting frustration in your inability to zero-in on the factors that drive your solder balling, are you thinking that maybe you need to bite the bullet and design a experimental study to help isolate the key drivers to your solder balli
Electronics Forum | Mon Aug 23 17:43:18 EDT 2010 | davef
SAG: Questions on solder mask webbing with fine pitch parts are: * What is the minimum pitch that you can use webbing between fine pitch pads? * What solder mask do you use?
Electronics Forum | Wed Aug 25 15:02:04 EDT 2010 | spitkis2
I am printing solder paste directly onto a QFN device. Any recommendations on the type of solder paste to use? Namely I am concerned about getting a good release from the stencil. Thanks
Electronics Forum | Tue Sep 14 13:43:25 EDT 2010 | rayguide
Use No-Clean fine-particle solder paste from Kester. http://www.suite101.com/content/solder-paste-and-its-application-in-smt-a249514
Electronics Forum | Thu Sep 02 03:00:59 EDT 2010 | sachu_70
Hi Kevm, would it help to try solderability test of these pads using an agressive flux during soldering? Just a thought.
Electronics Forum | Thu Sep 02 11:45:47 EDT 2010 | kevm
We have tried solderability testing using an agressive flux and have had good results. However, our Mfg process uses laser soldering equipment which is a validated process and we are limited on the type and amount of flux we can use due to ionic cont
