Electronics Forum | Thu Apr 16 13:16:05 EDT 2009 | jeffharley
You might try checking to see if the float switches are actually lifting up with the water level, I have seen them get stuck in the open position. Also check to see that the solenoid valve is actually sealing off (closed)
Electronics Forum | Wed May 27 11:54:29 EDT 2009 | allwave
Armando, Make sure chip wave is pumping evenly across. These TD machines require a lot of maintenance (deep cleaning)to ensure all the holes on nozzle are open... My two cents, George
Electronics Forum | Fri Jul 31 02:59:52 EDT 2009 | dj_jago
I can't open the picture but if it is webbing and you are running with an alcohol based flux (non VOC free) another thing to check is the Specific Gravity.
Electronics Forum | Mon Sep 21 03:52:17 EDT 2009 | darrenj
Found the problem. A small part had previously fallen off the nozzle, and ended up behind the left centering jaw preventing the jaw from opening up fully. Cheers Darren
Electronics Forum | Wed Sep 30 14:17:06 EDT 2009 | davef
What does failure analysis of the BGA indicate? Is this: * ESD damage * Open circuits * Shorting What's the problem?
Electronics Forum | Thu Oct 01 03:03:29 EDT 2009 | cunningham
what we are getting is open circuits not every BGA is failing we use Humiseal 1A33 and currently there is no masking instruction for around the BGA
Electronics Forum | Fri Nov 13 11:10:07 EST 2009 | isd_jwendell
I'll second the recommendation for the GF-12 series, although I ended up with the Mistral-260 because of the exchange rate and the longer tunnel. Unfortunately the 260 does not open for easy access like the GF-12, although I haven't needed access yet
Electronics Forum | Thu Jan 28 10:28:59 EST 2010 | blnorman
2D with tilt will work. We have found opens on BGA balls with a 2D system tilted at the right angle.
Electronics Forum | Sun Feb 07 10:51:09 EST 2010 | davef
The ratio of aperture opening area to aperture wall area is a critical evaluation measure for the release of the printed solder paste. The stencil thickness has the biggest impact on area ratio.
Electronics Forum | Mon Feb 08 23:44:31 EST 2010 | glennster
Woody, Daisy chain packages are definitely needed, but if you can get packages with a dummy chip inside these will provide a more accurate simulation of working components. If possible, continuous monitoring of resistance during the test will be
