Electronics Forum: solder problem (Page 425 of 507)

enig

Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller

We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 17 08:07:06 EST 2005 | grantp

Hi, What worries me is that a lot of people speak about what they have heard, but there is no firm facts on exactly what the situation is. I did a seminar on lead free a while ago, and was told that going lead free on the components while running l

Paste in hole (state of the art)

Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika

Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h

Flux Residues In Lead Free Wave Soldering Process

Electronics Forum | Tue Mar 28 11:17:19 EST 2006 | smartasp

Thanks for the input Guys Yeah the not so knowledgable customer does not like to residues for cosmetic resons. The flux is for lead free process, of the no clean and water soluable type. We have explained to him that technically the residues do not

AIM SN100C Solder paste

Electronics Forum | Fri Apr 07 17:44:07 EDT 2006 | ratsalad

I still have half of a 500 g jar of this paste left. I'm going to give it another shot, but my first experience was not so wonderful. Everything was great until we reflowed it. Our profile matched AIM's recommendation, as far as I can see. The ch

Types of OSP Coating

Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef

We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther

Solder Paste Inspection Systems

Electronics Forum | Fri Dec 28 17:44:41 EST 2007 | flipit

Back in the mid 90s I used an SVS 3D solder paste inspection system. We used it as a stand along unit but it was an inline model. We would bring printed PCBs off the Dek 265 solder printers and check every 5 or 10 printed panels. They almost alway

What caused this reflow issue?

Electronics Forum | Thu Apr 17 05:14:40 EDT 2008 | gregoryyork

I have seen similar things like this before with Solder Resist redepositig back on the pads, this is a clear residue very hard to see. Solder resist will obviously resist solder adhering to it. If you rework the boards then the heat of the iron will

Using Vapour Phase Soldering Process

Electronics Forum | Wed Dec 15 12:50:39 EST 2010 | hegemon

We evaluated Vapor Phase Reflow in 2010, and in the short time I experienced the machine, I came away with the following. The advantages you are (hopefully)already aware of, such as overall tranfer of heat to the PCB, no chance of temperature oversh

ICT testing to improve yields

Electronics Forum | Mon Aug 27 10:23:41 EDT 2012 | cobham1

I need to clarify something for everyone. The end customer is the Military. Our customers are military suppliers who do in fact have quality systems in place. When we build the product we end up potting the unit so the customer never looks at the ele


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