Electronics Forum: solder problem (Page 426 of 507)

Using Vapour Phase Soldering Process

Electronics Forum | Wed Dec 15 12:50:39 EST 2010 | hegemon

We evaluated Vapor Phase Reflow in 2010, and in the short time I experienced the machine, I came away with the following. The advantages you are (hopefully)already aware of, such as overall tranfer of heat to the PCB, no chance of temperature oversh

ICT testing to improve yields

Electronics Forum | Mon Aug 27 10:23:41 EDT 2012 | cobham1

I need to clarify something for everyone. The end customer is the Military. Our customers are military suppliers who do in fact have quality systems in place. When we build the product we end up potting the unit so the customer never looks at the ele

Thoughts on having AOI catch components that are supposed to be non populated???

Electronics Forum | Thu Feb 28 10:40:56 EST 2013 | rway

I have been doing this since day one of getting the AOI. It just seemed logical. I don't know what type of AOI you have, but what I have found works best is to use solder inspection to catch parts that are loaded into a no-load location. Move the

Cleaning a Used (Preowned) Selective Solder Machine

Electronics Forum | Wed Sep 16 18:06:14 EDT 2015 | pmcg

Problem with cleaning these machines is once you start it's easy to get carried away. ;) We cleaned our SPA-400F a few months ago, had been offline for a while as we were using our SPA-250. It started as just a clean and to replace all the flux pip

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo

A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 10:00:45 EDT 1999 | Boca

| | Ladies and Gentlemen, | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav treme

bulbous joint

Electronics Forum | Fri Feb 20 12:55:43 EST 2004 | russ

Ah, the old contour wave. I don't really know how to adjust those to get correct backflow to reduce your solder volume. I need to ask why you are worried about this. Do you have a QC requirement in excess of IPC class3 wich allows for this joint t

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics

Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his

Vapor phase versus forced convection

Electronics Forum | Mon Aug 16 20:19:10 EDT 2004 | Grant

Hi, We have both Vapor Phase ASSCON semi auto as well as Soltec convection inline ovens. I must say we had no end of problems with Vapor Phase. We tried everything, and just could not totally eliminate tomb-stoning completely. We would always get a

Re: 600 pin BGA Reliability

Electronics Forum | Tue Jul 27 16:22:17 EDT 1999 | Earl Moon

| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the


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