Used SMT Equipment | Pick and Place/Feeders
SIPLACE TX2i Parameters Placement speed: up to 96,000cph (benchmark), up to 127,600cph (theoretical) Machine size (length x width x height): 1.00m x 2.23m x 1.45m Placement heads: SIPLACE SpeedStar (CP20P2), SIPLACE MultiStar (CPP), SIPLACE TwinStar
1) 4 layers board, 1.2mm thickness 2) Min. track width: 0.13mm 3) Min. track space: 0.12mm 4) Min. hole size: 0.3mm 5) Finish: immersion gold
Project Description | Parameters 12 Layer Thickness: 2.4+/-0.24 mm Min Hole Size: 0.25 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Black Drill 12 Layer | Application Consumer Electronics
Project Description | Parameters 1 Layer Thickness: 1.2+/-0.1 mm Min Hole Size: 3.175 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: OSP | Craft White Ink 3W Heat Dissipation Coefficient | Application LED Light
New Equipment | Fabrication Services
Project Description | Parameters 10 Layer Thickness: 1.6+/-0.16 mm Min Hole Size: 0.15 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: ENIG+Gold Finger | Craft Red Ink Gold Finger | Application Industrila Control
Project Description | Parameters 16 Layer Thickness: 3.8+/-0.03 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Material: SY ST115 Thermal Conductive:1.5W/m.k Back drilling, laser drilling | Application Electronic Power
New Equipment | Fabrication Services
Project Description | Parameters 4 Layer Thickness: 1.8+/-0.18 mm(High Tg S1000-2 Material) Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Castellated Holes High Tg S1000-2 Material | Application Automobile
New Equipment | Cable & Wire Harness Equipment
Project Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Black Ink Rigid-Flex Board | Application Consumer Electronics
New Equipment | Wave Soldering
Project Description | Parameters 4 Layer Thickness: 0.3+/-0.05 mm Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Impedance:100+/-10% Unit Size:180*100 mm | Application Industrial Control
New Equipment | Assembly Services
Project Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Black Ink Rigid-Flex Board | Application Consumer Electronics
