Electronics Forum | Thu Jul 09 05:52:49 EDT 2015 | kfquan
Have you tried the so called push-back or re-insertion type panel? 5mm*12mm*0.3mm thick FR-4, 120-up panel is doable.
Electronics Forum | Fri Feb 10 16:21:32 EST 2017 | cromaclear
Contamination color is silver dust, like ash dust from burning wood. The pressure of nitrogen is 27 and the flow is 0.3. Do you know where can i find some documentation about nitrogen and fluxing?
Electronics Forum | Sat Apr 23 00:21:10 EDT 2011 | azrina
As am doing screening right now, am not measuring the total cleanliness yet, i just observe by taking photos (FYI, am varying speed for conveyor belt for cleaning) and see whether the flux is able to be removed by certain parameters. the speed am usi
Electronics Forum | Thu Oct 21 13:08:38 EDT 2021 | ademrah
Hi, It depends on smallest pitch size of your components. For the 0.3 um, 0.5 um, etc. sizes could be mentioned on Clean Room. For example; for ISO-7 standart (Class 10,000) higher than 5um is not acceptable, however 1mm can acceptable to describ
Electronics Forum | Sun Aug 01 21:17:52 EDT 2004 | Eric
I have already been working with GPD regarding this project but at the same time the stage of the project is still on the selection process so I'm still open to other machines to be qualified. As per current machine in house (Micromax II), we have
Electronics Forum | Thu Aug 24 19:26:07 EDT 2006 | darby
Dave, Cygnal was taken over by Silabs. I based my design on the second link that you provided. Tell me folks, are you using one large pad with only the stencil having the grid, or are you actually breaking up the large pad into grids with mask around
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Thu Sep 07 07:36:57 EDT 2017 | tsvetan
we use 0.12 mm stencil with 0.3 mm apretures for 0.5mm step FBGA153 memory without problems the solder paste is SAC305 Class4 http://www.olimex.com/Products/Components/Soldering/SOLDER-PASTE-SAC305-CLASS4/
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Tue May 25 12:59:37 EDT 2004 | gregp
Mils to MM is actaully English to metric. 1 mil is equal to 1 thousandth of an inch (0.001")or 0.0254mm so... 12mil pitch qfp is 0.012" or 0.3mm 15mil pitch qfp is 0.015" or 0.4mm 20mil pitch qfp is 0.020" or 0.5mm (Numbers are rounded)
