Industry News | 2017-07-17 18:33:56.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.
Industry News | 2018-03-14 15:03:10.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. Professional development courses will take place January 27, 28 and 31, 2019 and the technical conference will take place January 29–31, 2019.
Industry News | 2018-06-20 20:36:50.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.
Industry News | 2019-02-18 17:18:54.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.
Industry News | 2019-09-10 13:25:11.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.
Industry News | 2020-03-08 16:23:52.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.
Industry News | 2013-04-03 18:46:12.0
IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.
Industry News | 2014-12-17 19:57:30.0
Fuji's Scalable Placement Platform NXT III now supports 0201 mm (0.25 x 0.125 mm, 008004") components as standard. By loading the newly developed H24G head on the NXT III, 0201 mm (0.25 x 0.125 mm, 008004") components can be supported without any change to the specifications of the machine (speed: 35,000 cph, accuracy: ±25 μm). The Intelligent Part Sensor (IPS), which checks the orientation of parts on the nozzle and ensures that the part does not remain on the nozzle after placement, is standard on the H24G placement head.
Industry News | 2009-01-30 18:39:51.0
S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.
