Electronics Forum | Mon Dec 20 12:50:27 EST 1999 | Wolfgang Busko
Hi Pascal, 0,65mm pitch normally isn�t much of a problem. With 90�m CU I don�t have any experience but would like to know what deviation from nominal value for the pads you get with different PCB-deliveries. In short, for the standard Cu=35�m we se
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Tue Jan 30 15:30:17 EST 2001 | dason_c
Please check what is the actual pitch size. I found some of the designer use 15.7 mil pitch and no accumulate ie 15.7, 15.7 and 15.8...... Also, I recommended the pad width should be 10 - 11 mil for 0.4mm pitch. You can open the 10 - 10.5 mil aper
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Mon Aug 23 10:11:55 EDT 2010 | flipit
Hi, I have never been able to find an acceptable dispense process for dispensing small dots of solder paste. I currently have an auger screw automated dispense system and can not accomplish 0.010" dot sizes. In addition, stencil printing is much m
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
Electronics Forum | Sat Feb 10 17:12:03 EST 2001 | rpereira
I admit, 16 mil QFP printing is very challenging but if all your control factors (print speed, etc...) are setup correctly (through DOE) extremely high yields can be achieved and more importantly a repeatable and robust product will be manufactured.
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
