Electronics Forum | Wed Apr 21 20:08:37 EDT 2004 | Dreamsniper
Now the ball starts rolling. I'm lookin' for a new aqeous cleaner. Do I really need chemical cleaners or saponifiers, surfactant etc. for an Aqeous Cleaning Machine in removing OA or Water Soluble flux from under my 1.27mm Pitch BGA down to 1mm Pitch
Electronics Forum | Tue Jun 01 12:48:49 EDT 2004 | pjc
AP25 can handle warped boards to a degree. I also depends on the board clamping system on the machine. There are three avbl. First is Universal Vacuum box, second is dedicated tooling with vacuum and third is Y Snugger tooling that does not use vacuu
Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS
For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum
Electronics Forum | Fri Oct 14 17:08:36 EDT 2005 | Mika
What? That is easily done. With a 127 micron stencil thickness and apertures made for a QFP 0.5mm pitch... Remember from school of how You squeeze a media under a certain presure (like air), from a bigger diameter towards a smaller nozzle, You will i
Electronics Forum | Fri Sep 22 15:35:14 EDT 2006 | lheiss
Hello all, Finally ready to run my first 14 up array and the machine picks up the part moves to the placement location, them moves to home and drops the part. The Z axis never moves. I do get a "run error 1" at about the 4th placement (if it was a
Electronics Forum | Mon Dec 04 21:42:12 EST 2006 | KEN
Keep in mind that device pitch, pad geometry, lead length and even alloy type will play a roll in your evaluation. I have an assembly that we run 10k pieces per month. One two-pin connector has a pitch of 1.27mm. Unfortunately, the pads are 0.007"
Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Thu Jun 05 21:59:22 EDT 2008 | mika
bsumfg, The very best anybody said lately!! This should go straight into the the manual! I totally agree with you; Just an add: The fid's should never be mistaken for a test point who normally is between 1.0 - 1.27 mm so make the fids 1.5 mm. round
Electronics Forum | Mon Oct 06 14:10:55 EDT 2008 | chineechooze
0.001969" You say that 0.008" of "slop" is un-doable; hence, the reasons for our failures. Any basis for that statement? Are rated accuracies from placement equipment manufacturers typically "exgaggerated?" 2. On PCB Fab side of things, what is
Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
