Industry News: amkor (Page 5 of 8)

Practical Components Offers Dummy Triple Stack Package on Package

Industry News | 2008-05-23 18:09:23.0

LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).

Practical Components, Inc.

Amkor ULTRA CSP� Test Die

Industry News | 2002-09-17 15:09:18.0

Practical Dummy Components

Practical Components, Inc.

Practical Components Adds Amkor's FusionQuad� Test and Thermal Cycle Boards to Its Lineup

Industry News | 2008-12-15 15:28:33.0

LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.

Practical Components, Inc.

Practical Components® to Exhibit Its Newest Wafer and Evaluation Vehicles Technologies at IWLPC

Industry News | 2018-10-15 18:31:07.0

Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.

Practical Components, Inc.

Practical Components® to Exhibit Its Newest Wafer and Evaluation Vehicles Technologies at IWLPC

Industry News | 2018-10-18 19:55:33.0

Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.

Practical Components, Inc.

Visit Practical Components at APEX to Learn about the Latest Innovations in Components, Test PCBs and Solder Training Kits

Industry News | 2019-01-05 16:48:58.0

Practical Components is a premier supplier to the global electronics industry specializing in mechanical IC samples or “dummy” components, evaluation PCBs and solder training kits. Practical will feature its latest technology in booth 1609 at the upcoming IPC APEX EXPO 2019 exhibition and convention, scheduled to take place January 29-31, 2019 at the San Diego Conference Center in California.

Practical Components, Inc.

Amkor Technology invites you to join us at the FREE Electronic Design Process Symposium (EDPS)

Industry News | 2020-09-23 11:45:08.0

Amkor Technology invites you to join us at the FREE Electronic Design Process Symposium (EDPS) virtual event September 30-October 1, 2020. EDPS is the leading forum for advanced chip and systems design processes. Amkor's Gerard John, Sr. Director, FCBGA, will present "Using Machine Learning to Optimize Semiconductor Test" on October 1st at 5:50 PM PST.? Abstract: Machine learning (ML) is a field of engineering under the artificial intelligence (AI) umbrella, based on the idea that systems can learn from data, identify patterns and make decisions with minimal human intervention. ML is often used as a prediction tool to perform analysis on large amounts of data, automate analytical model building and provide the user (human, machine or calling function) with event occurrence probability. To date, the test community has not embraced ML and continues to look at ML with skepticism when approached with the paradigm shift - replacing conventional product test suites with a test suite selected by an ML algorithm. This skepticism may be the result of multiple factors, such as limited familiarity with ML, partial awareness of its capabilities, lack of tools that can be easily used and the workload involved in the process of training a machine to discern data. In addition, by running a compressed test suite suggested by ML, questions arise about test escapees and their potential impact on product quality. This talk uses the example of an Open-Short test to shed light on optimizing semiconductor test using ML. For more information and to register for this FREE event, visit the EDPS website

Amkor Technology, Inc.

Practical Components Introduces New Kit for Test and Qualification of the Amkor TMV® Component

Industry News | 2011-06-13 18:06:01.0

Practical Components announces that the new Practical Components TMV® (Through Mold Via) 14 mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14 mm Amkor TMV® component.

Practical Components, Inc.

Practical Components to Premier New Amkor PoP Stacked Packages at SMTAI 2011

Industry News | 2011-09-28 19:44:39.0

Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #604 at the upcoming SMTA International Conference & Exhibition

Practical Components, Inc.


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