New Equipment | Surface Finish
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications. The StratoSPHERE plasma system is ideal for wafer pro
Industry News | 2013-12-04 10:06:34.0
ASM Pacific Technology Limited has entered into an agreement with Dover Printing & Identification, Inc. and Dover Corporation to acquire printer specialist DEK. If approved by the antitrust authorities, ASMPT will integrate DEK into its SMT business segment which ASMPT established in 2011 when it acquired the SIPLACE SMT placement machine business from Siemens.
Industry News | 2012-05-06 07:04:16.0
In South America, during the past years Brazil has emerged as a highly flourishing market in the field of electronics, and is currently playing an increasingly important role in the market.
Industry News | 2018-08-02 04:41:30.0
The PA500X Series SMT Inductors are offered in PA5001, PA5002, PA5003, PA5004, PA5005, PA5006, and PA5007 models. The PA500X series inductors are available in five platform sizes in ranging from 4 x 4 to 8 x 8 mm with profile height down to 2.1 mm.
Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA
Adhesives & Bonding Expo
Career Center | Racine, Wisconsin USA | Engineering,Maintenance,Production,Technical Support
We are currently seeking a SMT Process Technician to join our already strong team in a state-of-the-art SMT/PTH facility, only 5 years old. This position will be responsible for all aspects of printed circuit board assembly, from programming of eq
Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ
New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Industry News | 2011-06-13 18:06:01.0
Practical Components announces that the new Practical Components TMV® (Through Mold Via) 14 mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14 mm Amkor TMV® component.
