Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
Electronics Forum | Tue Feb 06 13:24:31 EST 2007 | stepheniii
Good afternoon, > > You have to use lead paste > since none-RoHS components won�t withstand > elevated temperatures. Solder paste manufacturers > offer a lot of transitional pastes designed > specially for mixed process. Ask your paste > suppli
Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
Electronics Forum | Tue Jul 30 17:45:56 EDT 2002 | davef
What's this 'metalic coating on both sides'? Is that like a 'two-sided board'? I expect that your 200�F is the primary side temperature just prior to entering the wave. If not, you need more juice [depending on your flux and all that]. [Some mode
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Electronics Forum | Mon Jul 07 00:45:39 EDT 2014 | comatose
If you study how the process is done now, it isn't that different from what you describe. Instead of glue, we use solder paste, and instead of spraying it we screen print it. But not that different. For feeding boards we use conveyors instead of rubb
