Apex 2011 - Don't miss these top exhibitors. Discover New Technologies, Processes, Equipment and Solutions Solar Pavilion, Defect Clinic and Steve Wozniak Highlight IPC APEX EXPO 2011 The world of electronics manufacturing is constantly moving
-off-the-shelf ball/column grid array packaging (COT
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
SMTnet Express, May 21, 2020, Subscribers: 29,050, Companies: 11,006, Users: 25,816 WE'RE MOVING!..or rather we have moved!.. and we didn't call you for help with the couch!... that will explain why you may have encountered the gremlins... we moved
