Electronics Forum | Tue Aug 10 15:28:54 EDT 2004 | Shean Dalton
Because the HASL process most deal with bare metals, HASL flux residues are generally more active than solder paste residues. Typically a Rosin Active (RA) flux is used in the HASL process. These flux residues should be removed from the bare board
Electronics Forum | Mon Apr 05 04:50:28 EDT 2004 | harris
Hello: What's the difference of the OSP, HASL, Ni/Au immersion and ENIG? What's the advantage and disadvantage of them, special for the BGA pad? I had seen some discussion in the forum, but they are for a long time ago. Could somesone can give me the
Electronics Forum | Tue Sep 14 04:00:12 EDT 2010 | genesan
Hi Sir grahamcooper22, There should not a issue in stencil since i had open the aperature 1:1(one to one).Futhemore this is HASL pcb coating as now our customer had convert to immersion silver.I had do comparison between both and found HASL wetting n
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
Electronics Forum | Mon Jan 29 10:41:30 EST 2007 | aj
Rob, We have ran LF BGA's with Lead Paste in the past. We actually got a MicroSection Analysis carried out and a full report which approved the Process. We had peak Temp around 225oC- 230oC . Its a matter of running the Lead Process at its max and
Electronics Forum | Thu Aug 15 15:58:12 EDT 2002 | robertnguyen
To whom this may concern, I recently ran into the problem with vias on pads of BGA when place BGA and reflow gas trap on vias escape and result in ball having void greater than 50% of BGA diameter. The BGA pad is measured at 20 mils and the vias mea
Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22
Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp
Electronics Forum | Mon Aug 09 17:02:32 EDT 2004 | arminski
Hi Shean, Thanks for the analysis. "Your product looks like it may have non-solder-mask-defined pads." Yes. It is a NSMD PCB. "Does there appear to be any residues on the bare boards, and/or, BGA components prior to applying the solder paste?"
Electronics Forum | Thu Nov 03 12:52:23 EST 2005 | Amol
the only problem i see here is the neighboring components (depending upon the component density) will surely undergo a second reflow during the rework stage for the BGA. this way the only lead you will have in the BGA assembly is if you are using HA
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
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