Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Fri Jan 15 08:11:34 EST 1999 | Jim Nunns
Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK Regards Jim |
Electronics Forum | Fri Jan 15 15:29:03 EST 1999 | Jason Hall
| Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | Regards | Ji
Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Fri Jan 15 08:09:56 EST 1999 | Jason Hall
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Thu Feb 19 12:52:08 EST 1998 | Earl Moon
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? My specifications require rejection and study if voiding exceeds 2% of solder joint volume measured using x-ray and/or x-sectional analysis. My
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman
If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle
